| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | Clte-Xt (PTFE-Based Composite) |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
|---|
| Payment Methods: |
|
|---|---|
| Support payments in USD |
| Secure payments: | Every payment you make on Made-in-China.com is protected by the platform. |
|---|
| Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
|---|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
General Description
The Rogers CLTE-XT High Frequency PCB is a double-sided circuit board designed for high-performance microwave and RF applications. Built on 40mil (1.016mm) CLTE-XT substrates, this PCB features a green solder mask and white silkscreen on the component side, with immersion gold plating on the pads (minimum 2 microinch gold over 120 microinch nickel). The board size is 150mm x 65mm, with a standard 1oz finished copper thickness. Manufactured in compliance with IPC Class II standards, each board undergoes 100% open-short circuit testing before shipment. Boards are vacuum-packed in bags of 25, with 12 kg per box for secure delivery.
| PCB SIZE | 65mm x 150mm=1 piece |
| BOARD TYPE | High Frequency PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | N/A |
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate top layer |
| CLTE-XT 1.016mm | |
| copper ------- 17um(0.5 oz)+plate bot layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 12 mil / 12 mil |
| Minimum / Maximum Holes: | 0.4 mm / 4.8 mm |
| Number of Different Holes: | 9 |
| Number of Drill Holes: | 102 |
| Number of Milled Slots: | 1 |
| Number of Internal Cutouts: | 1 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | CLTE-XT 1.016mm |
| Final foil external: | 1 oz |
| Final foil internal: | 1 oz |
| Final height of PCB: | 1.2 mm ±0.12 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold, 43.57% |
| Solder Mask Apply To: | Both sides |
| Solder Mask Color: | Green |
| Solder Mask Type: | Glossy |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Top side |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | 94V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
| Properties | CLTE-XT | Units | Test Conditions | Test Method | |
| Electrical Properties | |||||
| Dielectric Constant | 2.79 (5.1mil) | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
| 2.89 (9.4mil) | |||||
| 2.92 (20mil) | |||||
| 2.94 (30mil) | |||||
| Dissipation Factor | 0.0010 | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
| Dielectric Constant (design) | 2.93 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
| Thermal Coefficient of Dielectric Constant | -8 | ppm/˚C | -50°C to 150°C | 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 4.25x108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 2.49x108 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Electrical Strength (dielectric strength) | 1000 | V/mil | - | - | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | 58 | kV | D-48/50 | X/Y direc- tion | IPC TM-650 2.5.6 |
| Thermal Properties | |||||
| Decomposition Temperature (Td) | 539 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
| Coefficient of Thermal Expansion - x | 12.7 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 13.7 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 40.8 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.56 | W/(m.K) | - | z direction | ASTM D5470 |
| Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
| Mechanical Properties | |||||
| Copper Peel Strength after Thermal Stress | 1.7 (9) |
N/mm (lbs/ in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD, CMD) | 40.7, 40.0 (5.9, 5.8) |
MPa (ksi ) | 25˚C +_ 3˚C | - | ASTM D790 |
| Tensile Strength (MD, CMD) | 29.0, 25.5 (4.2, 3.7) |
MPa (ksi ) | 23C/50RH | - | ASTM D638 |
| Flex Modulus (MD. CMD) | 3247, 3261 (471, 473) |
MPa (ksi ) | 25C+_ 3C | - | ASTM D790 |
| Dimensional Stability (MD, CMD) | -0.37, -0.67 | mm/m | 4 hr at 105˚C | - | IPC-TM-650 2.4.39a |
| Physical Properties | |||||
| Flammability | V-0 | - | - | C48/23/50 & C168/70 | UL 94 |
| Moisture Absorption | 0.02 | % | E1/105+D24/23 | - | IPC TM-650 2.6.2.1 |
| Density | 2.17 | g/cm³ | C-24/23/50 | - | ASTM D792 |
| Specifc Heat Capacity | 0.61 | J/g˚K | 2 hours at 105˚C | - | ASTM E2716 |
| NATA Outgassing | |||||
| Total Mass Lost | 0.02 | % | - | - | ASTM E595 |
| Collected Volatiles Condensable Material | 0 | ||||
){kind=link}