4-Layer electronic PCB with It-180A and 94V0
| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | It-180A |
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Basic Info.
- Model NO.
- BIC-470-V3.0
- Material
- Fr-4 (It-180A High Tg Multifunctional Filled Epoxy
- Application
- Automotive Engine Room ECU
- Flame Retardant Properties
- V0
- Mechanical Rigid
- Rigid
- Processing Technology
- Immersion Gold
- Base Material
- Fr-4 (It-180A High Tg Multifunctional Filled Epoxy
- Insulation Materials
- Fr-4 Epoxy Resin
- Brand
- Iteq (It-180A)
- Board Types
- Rigid PCB
- Test
- 100% Electrical Test Prior Shipment
- Type of Artwork to Be Supplied
- Email File, Gerber RS-274-X, PCB.Doc etc
- Service Area
- Worldwide, Globally
- Transport Package
- Express Boxed
- Specification
- 130 mm x 175 mm (6 pieces)
- Trademark
- bicheng
- Origin
- Shenzhen China
- HS Code
- 8534009000
- Production Capacity
- 360000 Square Meters/Year
Product Description
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction of IT-180A
IT-180ATC is a high Tg (175°C by DSC) multifunctional filled epoxy known for its excellent thermal reliability and CAF resistance. It is suitable for various applications and can withstand lead-free assembly processes at temperatures up to 260°C.
Typical Properties
Glass Transition Temperature (Tg): 175°C by DSC
Lead-Free Process Compatibility: Yes
Coefficient of Thermal Expansion: X-Axis 11-13 ppm/°C, Y-Axis 13-15 ppm/°C
Time to Delaminate (Copper removed): T260 of 60 minutes, T288 of 20 minutes
Dielectric Constant (DK): 4.4 at 1 GHz, 4.5 at 1 MHz
Loss Tangent (Df): 0.014 at 1 MHz, 0.015 at 1 GHz
CAF Resistance: Excellent
Through-Hole Reliability: Good
Moisture Resistance: 0.1%
Flammability Rating: UL94-V0 for laminate and laminated prepreg
PCB Construction Details:
| Specification | Details | |
|---|---|---|
| Base Material | FR-4 (IT-180) | |
| Layer Count | 4 layers | |
| Board Dimensions | 130mm x 175mm (6 PCS), ± 0.15mm | |
| Minimum Trace/Space | 4/6 mils | |
| Minimum Hole Size | 0.2mm | |
| Blind Vias | L1-L2 | |
| Finished Board Thickness | 1.6mm | |
| Finished Copper Weight | 1oz (1.4 mils) outer layers | |
| Via Plating Thickness | 20 µm | |
| Surface Finish | Immersion Gold | |
| Top Silkscreen | White | |
| Bottom Silkscreen | White | |
| Top Solder Mask | Green | |
| Bottom Solder Mask | Green | |
| Electrical Testing | 100% electrical test prior to shipment | |
| Countersink Holes | On the top side | |
PCB Stack-Up (4-Layer Rigid PCB)
| Layer | Material | Thickness | |
|---|---|---|---|
| Copper Layer 1 | Copper | 0.035 mm | |
| Prepreg | 7628H X 1 | 0.21 mm | |
| Copper Layer 2 | Copper | 0.035 mm | |
| IT-180ATC Core | Core | 1.03 mm (40.5 mil) | |
| Copper Layer 3 | Copper | 0.035 mm | |
| Prepreg | 7628H X 1 | 0.21 mm | |
| Copper Layer 4 | Copper | 0.035 mm |
PCB Statistics:
Components: 59
Total Pads: 137
Through Hole Pads: 86
Top SMT Pads: 51
Bottom SMT Pads: 12
Vias: 73
Nets: 4
Artwork and Standards Information
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Typical Applications
Automotive engine room ECU
Backplanes
Data storage
Server and networking equipment
Telecommunications
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