RF-10 High Frequency Printed Circuit Board PCB of Shenzhen Designer

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RF-10
• Model NO.: BIC-181-V2.1
• Material: Ceramic Filled PTFE and Woven Fiberglass
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Taconic
• Thickness: 10mil, 20mil, 60mil
• Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB
• Application: RF Applications
• Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Taconic RF-10 High Frequency Printed Circuit Board 10mil 20mil 60mil Low Loss High DK  PCB
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
Taconic's RF - 10 laminates are a sophisticated blend of ceramic - filled PTFE and woven fiberglass. These laminates stand out with a high dielectric constant of 10.2 at 10GHz and an impressively low dissipation factor of 0.0025 at the same frequency. By incorporating thin woven fiberglass reinforcement, Taconic's RF - 10 PCB achieve dual benefits: minimizing dielectric loss while enhancing rigidity, which simplifies handling and boosts dimensional stability, especially crucial for multilayer circuits.

Designed to meet the demand for cost - effective substrates in RF applications, RF - 10 high - frequency PCBs are ideal for reducing the size of RF components. They form a strong bond with smooth, low - profile copper, and when combined with the material's low dissipation and the use of ultra - smooth copper, they ensure optimal insertion losses at higher frequencies. At these frequencies, skin effect losses can significantly impact performance, but RF - 10 laminate effectively mitigates this issue, delivering reliable and efficient operation.

Features Benefits

1. Excellent adhesion to smooth coppers
2. Excellent dimensional stability
3. Excellent price/performance ratio
4. High thermal conductivity for enhanced thermal management
5. High DK for RF circuit size reduction
6. Low 0.0025 loss tangent @ 10 GHz
7. Low X, Y, Z expansion
8. Tight DK tolerance (10.2 +/-0.3)

 

Typical Applications

1. Aircraft Collision Avoidance Systems
2. GPS Antennas
3. Microstrip Patch Antennas
4. Passive Components (filters, couplers, power dividers)
5. Satellite Components

Our PCB Capability (RF-10)

PCB Capability (RF-10)
PCB Material:	Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation:	RF-10
Dielectric constant:	10.2
Dissipation Factor	0.0025 10GHz
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm  ), 125mil ( 3.175mm )
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

RF-10 Typical Values
 

RF-10 Typical Values
Property	Test Method	Unit	Value	Unit	Value
Dk @ 10 GHz	IPC-650 2.5.5.5.1 Mod.		10.2 ± 0.3		10.2 ± 0.3
Df @ 10 GHz	IPC-650 2.5.5.5.1 Mod.		0.0025		0.0025
TcK† (-55 to 150 °C)	IPC-650 2.5.5.6	ppm/°C	-370	ppm/°C	-370
Moisture Absorption	IPC-650 2.6.2.1	%	0.08	%	0.08
Peel Strength (1 oz. RT copper)	IPC-650 2.4.8 (solder)	lbs/in	10	N/mm	1.7
Volume Resistivity	IPC-650 2.5.17.1	Mohm/cm	6.0 x 107	Mohm/cm	6.0 x 107
Surface Resistivity	IPC-650 2.5.17.1	Mohm	1.0 x 108	Mohm	1.0 x 108
Flexural Strength (MD)	IPC - 650 - 2.4.4	psi	14,000	N/mm2	96.53
Flexural Strength (CD)	IPC - 650 - 2.4.4	psi	10,000	N/mm2	68.95
Tensile Strength (MD)	IPC - 650 - 2.4.19	psi	8,900	N/mm2	62.57
Tensile Strength (CD)	IPC - 650 - 2.4.19	psi	5,300	N/mm2	37.26
Dimensional Stability	IPC-650 2.4.39 (After Etch)	% (25 mil-MD)	-0.0032	% (25 mil-CD)	-0.0239
Dimensional Stability	IPC-650 2.4.39 (After Bake)	% (25 mil-MD)	-0.0215	% (25 mil-CD)	-0.0529
Dimensional Stability	IPC-650 2.4.39 (After Stress)	% (25 mil-MD)	-0.0301	% (25 mil-CD)	-0.0653
Dimensional Stability	IPC-650 2.4.39 (After Etch)	% (60 mil-MD)	-0.0027	% (60 mil-CD)	-0.0142
Dimensional Stability	IPC-650 2.4.39 (After Bake)	% (60 mil-MD)	-0.1500	% (60 mil-CD)	-0.0326
Dimensional Stability	IPC-650 2.4.39 (After Stress)	% (60 mil-MD)	-0.0167	% (60 mil-CD)	-0.0377
Density (Specific Gravity)	IPC-650-2.3.5	g/cm3	2.77	g/cm3	2.77
Specific Heat	IPC-650-2.4.50	J/g°C	0.9	J/g°C	0.9
Thermal Conductivity (Unclad)	IPC-650-2.4.50	W/M*K	0.85	W/M*K	0.85
CTE (X -Y axis) (50 to 150 °C)	IPC-650 2.4.41	ppm/°C	16-20	ppm/°C	16-20
CTE (Z axis) (50 to 150 °C)	IPC-650 2.4.41	ppm/°C	25	ppm/°C	25
Flammability Rating	Internal		V-0		V-0