High quality 4 Layer PCB fabrication with Immersion Gold board
Commodity Introduction
This is a type of FR-4 PCB for the application of switch. It's a layer board at 1.62mm thick. The
base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012
Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately.
Parameters & Data Sheet
| Item |
Requirement |
Result |
| Laminate |
Type |
FR-4 TG170 |
FR-4 TG170 |
| Supplier |
ITEQ |
ITEQ |
| Board thickness |
1.60±10% mm |
1.62-1.69 mm |
| Outer copper foil |
>=35 um |
42.72 |
| Inner copper foil |
35um |
35um |
| Warp-twist |
<= 0.75% |
0.09% |
| Legend |
Type |
KUANH SHUN |
KUANG SHUN |
| Color |
White |
White |
| Location |
CS |
CS |
| Marking |
Co.logo |
YES |
OK |
| UL.logo |
YES |
OK |
| Date code |
WWYY |
WWYY |
| Marking form |
NA |
OK |
| Location |
CS |
CS |
| Min line width (mil) |
6.3 |
6.5 |
| Min line spacing (mil) |
5.5 |
5.3 |
| Min ring width (mil) |
NA |
NA |
| Solder Mask |
Type |
KSM-6189BLM1 |
KSM-6189BLM1 |
| Color |
Blue Matt |
Blue Matt |
| Thickness |
>=10 um |
13 um |
| Pencil Test |
6H OR ABOVE |
OK |
| SOLVENT TEST |
NO ATTACK |
OK |
| TAPE TEST |
NO PEEL OFF |
OK |
| Surface Treament |
Immersion Gold |
OK |
| Special Treament |
Silk screen |
/ |
/ |
| Location |
/ |
/ |
| Forming |
V-cut |
OK |
| Normal Testing |
Electrical test |
100% PCB passed |
OK |
| Visual inspection |
IPC-A-600H&IPC-6012B |
OK |
| Solderability Test |
245ºC 5S 1 Cycle |
OK |
PCB Capability
More than 14 years of PCB experiences
Excellent after-sales service
Substrate material: Epoxy glass (FR-4), High frequency, Metal core
Price advantages on circuit boards
Multilayer PCB and Hybrid material of Multilayer PCB
Focus on prototypes, small batches and volume production
TS16949 (2009), ISO14001 (2004), ISO9001 (2008), UL certified
| Parameter |
Value |
| Layer Counts |
1-32 |
| Substrate Material |
FR-4(including High Tg 170, High CTI>600V);
Aluminum based; RO4350B,
RO4003C; 94HB and FR-1 (upon request) |
| Maximum Size |
Flying test: 900*600mm, Fixture test 460*380mm,
No test 1100*600mm |
| Board Outline Tolerance |
±0.0059" (0.15mm) |
| PCB Thickness |
0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) |
±8% |
| Thickness Tolerance(t<0.8mm) |
±10% |
| Insulation Layer Thickness |
0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track |
0.003" (0.075mm) |
| Minimum Space |
0.003" (0.075mm) |
| Outer Copper Thickness |
35µm--420µm (1oz-12oz) |
| Inner Copper Thickness |
17µm--420µm (0.5oz - 12oz) |
| Drill Hole(Mechanical) |
0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) |
0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) |
0.00295" (0.075mm) |
| Registration (Mechanical) |
0.00197" (0.05mm) |
| Aspect Ratio |
12:1 |
| Solder Mask Type |
LPI |
| Min Soldermask Bridge |
0.00315" (0.08mm) |
| Min Soldermask Clearance |
0.00197" (0.05mm) |
| Plug via Diameter |
0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance |
±10% |
| Surface Finish |
HASL,HASL LF,ENIG,Imm Tin,
Imm Ag, OSP, Gold Finger |
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