2-Layer Taiwan TU-768 FR-4 PCB 0.8mm High-Tg Black Solder Mask Board with Immersion Gold
1. Overview of TU-768 FR-4 PCB
This 2-layer rigid PCB leverages Taiwan Union's TU-768 FR-4 laminate, engineered for extreme thermal reliability and performance in demanding applications. With compact dimensions of 47.8mm x 47.8mm (±0.15mm) and a slim 0.8mm thickness, it supports high-density designs via 4/4 mil trace/space and 0.2mm micro-vias. Featuring immersion gold surface finish for corrosion resistance, a black solder mask on top, and white silkscreen, this board is 100% electrically tested to IPC-Class-2 standards, ensuring robustness for industrial use.
2. PCB Construction Details
Parameter |
Specification |
Base Material |
TU-768 FR-4 |
Layer Count |
2 layers |
Board Dimensions |
47.8mm x 47.8mm (±0.15mm) |
Min. Trace/Space |
4/4 mils |
Min. Hole Size |
0.2mm |
Board Thickness |
0.8mm |
Cu Weight (Outer) |
1oz (35μm) |
Via Plating |
20μm |
Surface Finish |
Immersion Gold |
Top Solder Mask |
Black |
Bottom Solder Mask |
None |
Top Silkscreen |
White |
Bottom Silkscreen |
None |
Electrical Test |
100% tested (IPC-Class-2) |
3. Key Features & Applications
Additional Components & Features
11 components with 24 pads (15 thru-hole, 9 top SMT).
7 vias and 2 nets for streamlined connectivity.
Artwork: Gerber RS-274-X.
Global availability with UV-blocking resin for AOI compatibility.
Material Advantages
TU-768 FR-4 delivers:
High-Tg (180°C) and thermal endurance: T288 >15 min, T300 >2 min.
Low CTE (11-15 ppm/°C), matched to copper for reduced warping.
CAF resistance, moisture protection, and lead-free compatibility.
Optimal electricals: Dk=4.3 and dissipation factor=0.0023 @ 10GHz.
Typical Applications
Consumer Electronics: Durable circuit boards for compact devices.
Servers/Workstations: High-reliability PCBs for thermal-intensive hardware.
Automotive Systems: Vibration-resistant boards for engine controls.
Why Choose This PCB?
Engineered for severe thermal cycles, this PCB combines TU-768 FR-4 PCB's anti-CAF properties, 350°C decomposition temperature, and AOI-friendly fluorescence with precision manufacturing. Ideal for applications requiring chemical resistance, low signal loss, and zero blind-via complexity, it exceeds IPC-Class-2 benchmarks for global deployments.
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Order Now for High-Performance Applications!
Elevate your designs with our 2-layer TU-768 FR-4 PCB-optimized for thermal resilience and signal integrity. Order now for fast global delivery to power next-gen automotive, server, or consumer electronics!