Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | Glass-Reinforced Hydrocarbon Ceramic |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Parameter | Specification |
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Base Material | Kappa 438 (Hydrocarbon ceramic) |
Layer Count | 2 Layers |
Board Dimensions | 91.17mm × 51.36mm (1 PC) |
Tolerance | ±0.15mm |
Minimum Trace/Space | 4/7 mils |
Minimum Hole Size | 0.25mm |
Finished Thickness | 1.1mm (40mil) |
Copper Weight | 1oz (35µm) outer layers |
Via Plating Thickness | 20µm |
Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
Silkscreen (Top) | White |
Solder Mask (Top) | Blue |
Electrical Test | 100% tested prior to shipment |
Standard Compliance | IPC-Class-2 |
Copper_layer_1 - 35 μm
Rogers Core Kappa 438- 1.016 mm (40mil)
Copper_layer_2 - 35 μm
PCB Statistics:
Components: 16
Total Pads: 52
Thru Hole Pads: 34
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 39
Nets: 2
1.Seamless FR-4 process compatibility with RF performance
2.Tight Dk tolerance (±0.05) superior to standard FR-4
3.Ultra-low Z-axis CTE (42 ppm/°C) for PTH reliability
4.High thermal stability (Tg >280°C)
5.-21 ppm/°C thermal coefficient of Dk (-50°C to 150°C)
5G small cell and DAS antennas
V2X communication systems
Carrier-grade WiFi/LAA equipment
IoT smart home devices
1.Cost-Effective Upgrade: 30% better RF performance than FR-4 at similar cost
2.Process Familiarity: Uses existing FR-4 fabrication infrastructure
3.Reliability: Survives 5× more thermal cycles than standard FR-4
4.Future-Proof: Ready for lead-free and high-temperature assembly
Order Now for:
Next-generation 5G infrastructure, automotive V2X systems, and IoT devices requiring UL 94-V0 compliance.
Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide