10mil Rogers RO3203 PCB Board at Low Electronic Components Price

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-121-V2.1
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Application: Microwave
• Thickness: 10 Mil
• Layer: 2-Layer
• Copper Weight: 0.5oz, 1oz or 2 Oz
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

10mil Rogers RO3203 High Frequency PCB 2-Layer DF 0.0016 Microwave PCB
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Rogers RO3203 High Frequency Circuit Materials are advanced ceramic-filled laminates reinforced with woven fiberglass, designed to deliver superior electrical performance and mechanical stability at cost-effective prices. With a dielectric constant of 3.02 and an ultra-low dissipation factor of 0.0016, Rogers RO3203 laminates support high-frequency applications exceeding 40 GHz.

RO3203 PCBs combines the smooth surface finish of non-woven PTFE laminates (enabling precise etching) with the structural rigidity of woven-glass PTFE laminates, making them compatible with standard PTFE PCB manufacturing processes. Available with 0.5, 1, or 2 oz/ft² (17, 35, 70 µm) electrodeposited copper cladding, these materials are produced under ISO 9002-certified quality control.
 

Features:
1. Woven glass reinforcement improves rigidity for easier handling.
2. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.
3. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.
4. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.
5. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs
and reliable surface mounted assemblies.
6. Excellent dimensional stability for high production yields.
7. Economically priced for volume manufacturing.
8. Surface smoothness allows for finer line etching tolerances
 

Typical Applications:
1. Automotive Collision Avoidance Systems
2. Automotive Global Positioning Satellite Antennas
3. Base Station Infrastructure
4. Datalink on Cable Systems
5. Direct Broadcast Satellites
6. LMDS and Wireless Broadband
7. Microstrip Patch Antennas
8. Power Backplanes
9. Remote Meter Readers
10. Wireless Telecommunications Systems

PCB Capability (RO3203)

PCB Capability (RO3203)
PCB Material:	Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation:	RO3203
Dielectric constant:	3.02±0.04
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin and OSP etc..

Data Sheet of RO3203

RO3203 Typical Value
Property	RO3203	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.02±0.04	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ	0.0016	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Conductivity	0.47 (3.2)		W/mK	Float 100ºC	ASTM C518
Volume Resistivity	107		MΩ.cm	A	ASTM D257
Surface Resistivity	107		MΩ	A	ASTM D257
Dimensional Stability	0.08	X, Y	mm/m +E2/150	after etch	IPC-TM-650  2.4.3.9
Tensile Modulus		X                 Y	kpsi	RT	ASTM D638
Flexural Modulus	400                 300	X                 Y	kpsi	A	ASTM D790
Tensile Strength	12.5                   13	X                 Y	kpsi	RT	ASTM D638
Flexural Strength	9                            8	X                 Y	kpsi	A	ASTM D790
Moisure Absorption	<0.1		%	D24/23	IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion	58                     13	Z                            X,Y	ppm/ºC	-50 ºCto 288ºC	ASTM D3386
Td	500		ºC	TGA	ASTM D3850
Density	2.1		gm/cm3	23ºC	ASTM D792
Copper Peel Stength	10 (1.74)		lbs/in (N/mm)	After solder	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-Free Process Compatible	Yes