F4btms1000 2-Layer PCB Board for Aerospace Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: F4btms1000
• Model NO.: BIC-1269-V3.0
• Material: F4btms1000 Laminate
• Application: Radar Systems.
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Enig
• Base Material: F4btms1000 Substrate
• Insulation Materials: F4btms1000 Substrate
• Brand: Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 57mm × 57mm( ± 0.15m)
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

The F4BTMS1000 2-layer PCB represents a cutting-edge advancement in high-frequency circuit board technology, specifically engineered for demanding aerospace and other applications. As an upgraded version of the F4BTM series, this PCB incorporates a proprietary blend of nanoceramics and PTFE resin with ultra-thin fiberglass reinforcement, achieving exceptional dielectric stability (Dk 10.2) and minimal signal loss up to 40GHz. Its revolutionary material composition minimizes electromagnetic wave interference from fiberglass while enhancing thermal conductivity and dimensional stability. With RTF low-roughness copper foil for reduced conductor loss and outstanding radiation resistance, this board meets stringent aerospace requirements including low outgassing for vacuum environments and stable performance across extreme temperatures (-55°C to 150°C).

 

 

PCB Construction Details (Summary Table)

Specification	Detail
Base Material	F4BTMS1000 (Ceramic-PTFE)
Layers	2
Dimensions	57×57mm (1 PC)
Tolerance	±0.15mm
Min Trace/Space	6/8 mils
Min Hole Size	0.4mm
Blind Vias	No
Thickness	2.1mm
Copper Weight	2oz (70μm) outer layers
Via Plating	20μm
Surface Finish	Immersion Gold
Silkscreen	None
Solder Mask	None
Special Features	Controlled depth slots
Electrical Test	100% tested

 

Other Key Components & Features
Stackup:

• Copper_layer_1 - 35 μm
  Rogers F4BTMS1000 Core - 2.0 mm
  Copper_layer_2 - 35 μm

• 
  PCB Statistics:
  Components:        10
  Total Pads:         27
  Thru Hole Pads:     18
  Top SMT Pads:      9
  Bottom SMT Pads:    0
  Vias:              17
  Nets:              2
   

Material Advantages:

• 1.Ultra-low dielectric loss (stable up to 40GHz)

• 2.Near-zero thermal expansion (CTE X/Y/Z: 8/10/20 ppm/°C)

• 3.3× better thermal conductivity vs standard FR4

• 4.Radiation-resistant with <0.1% outgassing (ESA ECSS-Q-ST-70-02C compliant)

• 5.RTF copper foil for 30% lower conductor loss

• 
   

• •  

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• Typical Applications:

• Satellite communication payloads

• Phased array radars

• Spacecraft avionics systems

• High-power aerospace RF amplifiers

•  

Why Choose This PCB?

• 1.Frequency Stability: Maintains Dk±0.02 from -55°C to 150°C

• 2.Reliability: Survives 500+ thermal cycles (MIL-STD-883)

• 3.Precision: 0.1mm slot machining capability

• 4.Safety: Meets NASA low outgassing standards

•  

Tags: F4BTMS1000 PCB,  Aerospace PCB, high-frequency circuit board, ceramic-PTFE laminate

 

Order Now for:

Space-grade communication systems, next-gen radar arrays, and satellite payloads requiring MIL-SPEC reliability.

 

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide