RO4003c 2-Layer PCB Board for RF Circuit Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1201-V3.0
• Material: RO4003c Laminate
• Application: Antennas
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Enig
• Base Material: RO4003c Substrate
• Insulation Materials: RO4003c Substrate
• Brand: Rogers
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 28.33 mm × 167.16 mm(± 0.15mm)
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

This 2-layer RO4003C PCB utilizes Rogers' advanced hydrocarbon/ceramic laminate, combining the electrical performance of PTFE materials with the manufacturability of epoxy/glass. With a dielectric constant (Dk) of 3.38 ±0.05 and low dissipation factor (0.0027 at 10GHz), it delivers exceptional signal integrity for high-frequency applications. The material's compatibility with standard FR-4 processing reduces fabrication costs while maintaining microwave-grade performance. Its low Z-axis CTE (46 ppm/°C) and high thermal stability (Tg >280°C) ensure reliability in demanding environments like cellular base stations and automotive radar systems.

 

 

PCB Construction Details (Summary Table)

Parameter	Specification
Base Material	RO4003C (Woven Glass Reinforced)
Layer Count	2 layers
Board Dimensions	28.33mm x 167.16mm (±0.15mm)
Minimum Trace/Space	5/5 mils
Minimum Hole Size	0.2mm
Blind Vias	No
Finished Thickness	0.3mm (8mil)
Copper Weight	1oz (35µm) per layer
Via Plating Thickness	20µm
Surface Finish	Immersion Gold
Silkscreen	Black (Top); None (Bottom)
Solder Mask	None (Top/Bottom)
Electrical Testing	100% tested prior to shipment

 

Other Key Components & Features
Stackup:

• Copper layer 1 - 35 μm
  Rogers 4003C Core - 0.203 mm (8mil)
  Copper layer 2 - 35 μm

• 
  PCB Statistics:
  Components:        21
  Total Pads:         63
  Thru Hole Pads:     34
  Top SMT Pads:      29
  Bottom SMT Pads:    0
  Vias:              79
  Nets:              2
   

Material Advantages:

• 1.Cost-Effective: Processes like FR-4 at lower cost than PTFE laminates.

• 2.Low Loss: Dissipation factor of 0.0027 at 10GHz.

• 3.Thermal Stability: Tg >280°C and CTE matched to copper (11-46 ppm/°C).

• 4.Versatility: Suitable for mixed-dielectric multilayer designs.

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• Typical Applications:

• Cellular base station antennas

• RF identification (RFID) tags

• Automotive radar and sensors

• Satellite LNB components

•  

Why Choose This PCB?

• 1.RF Optimized: Stable Dk and low loss for high-frequency signals.

• 2.Manufacturing Simplicity: No special PTFE handling required.

• 3.Reliability: Excellent PTH quality in thermal shock conditions.

• 4.Budget-Friendly: Competitive pricing for volume production.

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Tags:RO4003C PCB, RF Circuit Board, PCB Manufacturing, Electronics Board

 

Order Now for:

5G infrastructure, smart automotive systems, and high-volume RF applications requiring cost-effective performance.
 

Additional Notes:

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide