RO4533 2-Layer PCB Board for High-Frequency Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4533
• Model NO.: BIC-1203-V3.0
• Material: RO4533 Laminate
• Application: Low-PIM passive devices
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Immersion Silver
• Base Material: RO4533 Substrate
• Insulation Materials: RO4533 Substrate
• Brand: Rogers
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 85.89 mm × 161.45 mm(± 0.15mm)
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

This 2-layer RO4533 PCB utilizes Rogers' ceramic-filled, glass-reinforced hydrocarbon material, offering exceptional performance for high-frequency applications. With a dielectric constant (Dk) of 3.3 and a low dissipation factor (0.0025 at 10GHz), it is ideal for mobile infrastructure and antenna designs. The material's compatibility with standard FR-4 processing reduces manufacturing costs while maintaining superior electrical properties. Its low moisture absorption (0.02%) and high thermal stability (Tg >280°C) ensure reliability in demanding environments.

 

 

PCB Construction Details (Summary Table)

Parameter	Specification
Material	RO4533 (ceramic-filled hydrocarbon)
Layers	2
Dimensions	85.89 × 161.45mm (±0.15mm)
Trace/Space	4/6 mils
Holes	Min. 0.3mm (no blind vias)
Thickness	0.8mm (30mil)
Copper	1oz (35μm) outer layers
Vias	20μm plating
Finish	Immersion Silver
Markings	White silkscreen (top only)
Mask	Green solder mask (top only)
Testing	100% electrical test

 

Other Key Components & Features
Stackup:

• Copper_layer_1 - 35 μm
  Rogers 4533 Core - 0.762 mm (30mil)
  Copper_layer_2 - 35 μm

• 
  PCB Statistics:
  Components:        57
  Total Pads:         137
  Thru Hole Pads:     92
  Top SMT Pads:      45
  Bottom SMT Pads:    0
  Vias:              102
  Nets:              3
   

Material Advantages:

• 1. Low Loss: Dissipation factor of 0.0025 at 10GHz.

• 2.Thermal Stability: Tg >280°C and CTE matched to copper (11-37 ppm/°C).

• 3.Cost-Effective: Compatible with standard FR-4 processing.

• 4.Environmental: Halogen-free and low moisture absorption (0.02%).
   

• 

  

   

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• Typical Applications:

• Cellular base station antennas

• WiMAX antenna networks

• High-frequency RF components

• Mobile infrastructure

•  

Why Choose This PCB?

• 1.High Performance: Low Dk and loss for superior signal integrity.

• 2.Manufacturing Efficiency: No special PTFE handling required.

• 3.Reliability: Excellent thermal and dimensional stability.

• 4.Cost-Smart: Affordable alternative to traditional PTFE materials.

•  

Tags:RO4533 PCB, RF Circuit Board, Electronics Board, PCB Manufacturing

 

Order Now for:

 

5G infrastructure, wireless communication systems, and other high-frequency applications requiring reliable performance.
 

Additional Notes:

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide