Ad255c 2-Layer PCB Board for High-Frequency Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ad255c
• Model NO.: BIC-1266-V3.0
• Material: Ad255c Laminate
• Application: Cellular Infrastructure Base Station Antennas
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Enig
• Base Material: Ad255c Substrate
• Insulation Materials: Ad255c Substrate
• Brand: Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 36.56mm × 89.59mm (3 variants, ±0.15m
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

The AD255C 2-layer PCB is a high-performance circuit board designed for microwave and RF applications, particularly in telecommunication infrastructure. It features a PTFE-based, glass-reinforced laminate that ensures controlled dielectric constant, low loss, and excellent passive intermodulation (PIM) performance. With its stability across wide frequency and temperature ranges, this PCB is ideal for demanding environments, offering phase stability and compatibility with standard PTFE processing techniques. Its low insertion loss and superior PIM performance make it a preferred choice for antenna systems and other high-frequency applications.

 

 

PCB Construction Details (Summary Table)

Specification	Details
Base Material	AD255C (PTFE-based)
Layer Count	2 Layers
Board Dimensions	36.56mm x 89.59mm (3 Types = 3 PCS)
Tolerance	±0.15mm
Min. Trace/Space	5/7 mils
Min. Hole Size	0.3mm
Blind Vias	No
Finished Thickness	1.1mm
Copper Weight (Outer)	1oz (35µm)
Via Plating Thickness	20µm
Surface Finish	Immersion Gold
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Electrical Test	100% tested before shipment

 

Other Key Components & Features
Stackup:

• Copper_layer_1 - 35 μm
  AD255C - 1.016 mm (40mil)
  Copper_layer_2 - 35 μm

• 
  PCB Statistics:
  Components:        17
  Total Pads:         32
  Thru Hole Pads:     18
  Top SMT Pads:      14
  Bottom SMT Pads:    0
  Vias:              19
  Nets:              2
   

Material Advantages:

• 1.Very low loss PTFE and ceramic-filled composite.

• 2.Tight dielectric constant tolerance (2.55 at 10 GHz/23°C).

• 3.Low loss tangent (0.0013 at 10 GHz).

• 4.High decomposition temperature (>500°C).

• 5.Low moisture absorption (0.03%).

• 6.Excellent CTE stability (X: 34 ppm/°C, Y: 26 ppm/°C, Z: 196 ppm/°C).

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• Typical Applications:

• Cellular infrastructure base station antennas.

• Automotive telematics antenna systems.

• Commercial satellite radio antennas.

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Why Choose This PCB?

• 1.Superior high-frequency performance with low insertion loss.

• 2.Excellent phase stability and low PIM for antenna applications.

• 3.Robust construction suitable for harsh environments.

• 4.Compatible with standard PCB manufacturing processes.

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Tags:AD255C PCB, High-frequency PCB, RF circuit board, PTFE laminate, low-loss electronics.

 

Order Now for:

Telecommunication antennas, automotive RF systems, and satellite communication devices.
 

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide