| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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| PCB SIZE | 132 x 155mm=20PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 4 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 1.0mm | |
| copper ------- 35um(1oz) MidLayer 2 | |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 7.87mil/6mil |
| Minimum / Maximum Holes: | 0.5/1.0mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 975 |
| Number of Milled Slots: | 46 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4 |
| Final foil external: | 1.5oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (23.4%) 2micoinch over 100 microinch nickel |
| Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
| Solder Mask Color: | Gloss Green, Taiyo PSR-2000GT600D |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, Fiducial Marks |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100%Electrical Test prior shipment |
| APPLICATION: | SAN storage, Usb Motor Bluetooth Headset Led Lights Switch |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | FR-4(including High Tg 170, High CTI>600V); Aluminum based; RO4350B, RO4003C; 94HB and FR-1 (upon request) |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t<0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--420µm (0.5oz - 12oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
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