Wireless Control Panel PCB Design with Gold Plating, LCD, and PCBA Assembly

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: CEM-4
• Model NO.: BIC-036-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello Everyone,
Today we're talk about RO3003 high frequency PCBs.

RO3003 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designers to develop multi-layer board design feeling free and free, without encountering warpage or reliability problems.

Let's see some more features and applications.


 

1. low dielectric loss, DF=0.001, it can be used in applications up to 77 GHz.
2. Stable dielectric constant versus temperature and frequency, it's ideal material for band pass filters, microstrip patch antennas, and voltage controlled oscillators.
3. excellent mechanical properties versus temperature, it's reliable stripline and multi-layer board constructions.
4. Uniform mechanical properties, it's suitable for use with epoxy glass multi-layer board hybrid designs.
5. low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

Our PCB Capability (RO3003)

PCB Material:	Ceramic-filled PTFE composite
Designator:	RO3003
Dielectric constant:	3.0  ±0.04 (process)
	3.0 (design)
Layer count:	1 Layer, 2 Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 20mil (0.508mm)
	30mil (0.762mm), 60mil (1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

RO3003 high frequency PCBs are available with double sided, multi-layer and hybrid construction, copper ranges from 0.5oz to 2oz, thickness from 0.3mm to 1.6mm, maximum size 400 by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.



Typical Applications
1. Automotive radar applications
2. GPS Antennas
3. Power amplifiers and antennas
4. Patch antennas for wireless communications
5. Direct broadcast satellite


The basic colour of RO3003 PCB is white.

The manufacturing process of RO3003 high frequency PCB is similar to standard PTFE PCB, so it's suitable for volume manufacturing process winning advantageous market.

Should you have any questions, please feel free to contact us.

Thank you for your reading.

Appendix: Data Sheet of RO3003
 

RO3003 Typical Value
Property	RO3003	Direction	Units	Condition	Test Method
Electrical Properties
Dielectric Constant,εProcess	3.0±0.04	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.001	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-3	Z	ppm/ºC	10 GHz -50ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	10^7		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	10^7		MΩ	COND A	IPC 2.5.17.1
Thermal Properties
Td	500		ºC TGA		ASTM D 3850
Coefficient of Thermal Expansion (-55 to 288ºC)	17 16 25	X Y Z	ppm/ºC	23ºC/50% RH	IPC-TM-650 2.4.4.1
Thermal Conductivity	0.5		W/M/K	50ºC	ASTM D 5470
Mechanical Properties
Copper Peel Stength	12.7		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Young's Modulus	930 823	X Y	MPa	23ºC	ASTM D 638
Dimensional Stability	-0.06 0.07	X Y	mm/m	COND A	IPC-TM-650 2.2.4
Physical Properties
Flammability	V-0				UL 94
Moisture Absorption	0.04		%	D48/50	IPC-TM-650 2.6.2.1
Density	2.1		gm/cm^3	23ºC	ASTM D 792
Specific Heat	0.9		j/g/k		Calculated
Lead-free Process Compatible	Yes