6-Layer Isola 370hr PCB Wholesale Electronics PCB Board

• Customization: Available
• Structure: Multilayer Rigid PCB
• Dielectric: 370hr
• Model NO.: BIC-1035-V2.1
• Material: Fr-4, Tg 180°c
• Application: Radar
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Isola
• Surface Finish: Immersion Gold
• Laminate Thickness: 1.05mm
• Layer Count: 6-Layer
• Solder Mask: Matte Black (Top/Bottom)
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 178.25mm x 96.34mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

6-Layer ISOLA 370HR PCB 1.05mm Thickness High-Reliability ENIG Finish for Advanced Electronics
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Brief Introduction

1. Overview of 6-Layer ISOLA 370HR PCB
This 6-layer rigid PCB, fabricated with ISOLA 370HR high-performance FR-4 material, is engineered for applications demanding exceptional thermal reliability, precision signal integrity, and robust mechanical stability. Designed to meet IPC-Class-2 standards, the board features advanced construction with blind/buried vias, 50Ω impedance control, and castellated edge vias, making it ideal for high-density interconnect (HDI) designs in industries such as automotive, aerospace, networking, and medical instrumentation.

The PCB leverages ISOLA 370HR's unique properties-a 180°C glass transition temperature (Tg), low Z-axis CTE (45 ppm/°C), and superior CAF resistance-to ensure reliability in harsh thermal environments. With ENIG surface finish and resin-filled vias, this board delivers excellent solderability, corrosion resistance, and signal performance up to 10 GHz.
 

 
2. PCB Construction Details(Summary Table)

Parameter	Specification
Base Material	ISOLA 370HR (FR-4, Tg 180°C)
Layer Count	6 layers
Board Dimensions	178.25mm x 96.34mm (±0.15mm)
Finished Thickness	1.05mm
Minimum Trace/Space	3.5/4 mils
Minimum Hole Size	0.25mm
Via Types	Blind (L1-L2, L5-L6), Buried (L2-L3, L3-L4)
Via Plating Thickness	20 μm
Surface Finish	ENIG (Electroless Nickel Immersion Gold)
Solder Mask	Matte black (Top/Bottom)
Silkscreen	White (No silkscreen on solder pads)
Via Fill	0.25mm/0.4mm vias filled per IPC-4761 Type VII
Impedance Control	50Ω on top layer (referenced to L2)
Testing	100% electrical test pre-shipment

 

3. Additional Components & Features
Stackup Structure

Copper             Layer-1      35 micron                                    
 370HR             Prepreg       1080(65%) x 2, 0.135mm
 Copper            Layer-2      35 micron
  370HR Core                       0.18 micron
 Copper            Layer-3      35 micron
 370HR             Prepreg       1080(65%) x 2, 0.135mm       
 Copper            Layer-4      35 micron
  370HR Core                       0.18 micron
 Copper            Layer-5      35 micron            
 370HR             Prepreg       1080(65%) x 2, 0.135mm
 Copper            Layer-6      35 micorn.  

1. Key Attributes

Thermal Performance: T260 delamination >60 minutes, T288 >30 minutes.

Electrical Properties: Dk = 3.92 @10 GHz, Df = 0.025 @10 GHz.

Reliability: UL94-V0 flammability rating, CTI >175V, CAF-resistant.

Design Flexibility: Supports 237 vias, 253 pads, and mixed SMT/through-hole components.
 

1. Typical Applications

Networking: High-speed routers, 5G baseband units.

Automotive: ADAS control modules, EV power systems.

Aerospace: Avionics, radar communication systems.

Medical: Imaging equipment, diagnostic devices.
 

1. Global Availability & Compliance

Artwork Format: Gerber RS-274-X.

Standards: IPC-Class-2, UL certification.

Delivery: Worldwide shipping with consistent quality.
 

1. Why Choose This PCB?

The 6-layer ISOLA 370HR PCB combines high thermal resilience, precision impedance control, and advanced HDI capabilities in a cost-effective FR-4 solution. Its optimized stackup and resin-filled vias minimize signal loss, while the ENIG finish ensures long-term reliability in humid or high-temperature environments. With proven performance in sequential lamination and high-power applications, this board is a benchmark for next-generation electronics requiring uncompromised quality.

Tags: ISOLA 370HR PCB, 6-Layer ENIG PCB, 1.05mm Thickness PCB, High-Tg FR-4, HDI PCB Design
 

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