F4BTME298 2-Layer Rigid PCB: 1.6mm Thickness High-Performance Solution for Aerospace & RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Overview of this type of PCB
This 2-layer rigid PCB, with the base material of F4BTME298 laminate, stands out as a high-performance printed circuit board designed for demanding applications. Measuring 51.51mm x 111.92mm per piece (with a tolerance of +/- 0.15mm), it features a finished board thickness of 1.6mm. F4BTME298 PCB undergoes a 100% electrical test before shipment, ensuring reliability and functionality right from the start. With a surface finish of Immersion Tin, top silkscreen in white, and top solder mask in green, it combines both practicality and visual clarity for easy assembly and identification.
2. PCB Construction Details
| Parameter |
Details |
| Base Material |
F4BTME298 |
| Layer Count |
2 Layers |
| Board Dimensions |
51.51mm x 111.92mm (1PCS), +/- 0.15mm |
| Minimum Trace/Space |
6/5 mils |
| Minimum Hole Size |
0.3mm |
| Blind Vias |
No |
| Finished Board Thickness |
1.6mm |
| Finished Cu Weight |
1oz (1.4 mils) outer layers |
| Via Plating Thickness |
20 μm |
| Surface Finish |
Immersion Tin |
| Top Silkscreen |
White |
| Bottom Silkscreen |
No |
| Top Solder Mask |
Green |
| Bottom Solder Mask |
No |
| Pre-shipment Test |
100% Electrical test |
3. Other Key Components & Features
PCB Stackup Details
The PCB stackup of this 2-layer rigid PCB is carefully structured. It consists of Copper_layer_1 with a thickness of 35 μm, an F4BTME298 Core measuring 1.524 mm (60mil), and Copper_layer_2 also at 35 μm. This precise stackup contributes to the PCB's overall stability and performance, ensuring efficient signal transmission and component integration.
Additional Component Specifications
F4BTME298 PCB comes with 29 components, 75 total pads including 52 thru hole pads and 23 top SMT pads. It has 41 vias and 3 nets, and the artwork supplied is in Gerber RS-274-X format, meeting the IPC-Class-2 quality standard. These components and specifications work in harmony to support a wide range of functions and applications.
Material and Feature Advantages
The F4BTME298 base material offers remarkable advantages. Manufactured from a blend of glass fiber cloth, nano-ceramic fillers, and PTFE resin, it has a dielectric constant (Dk) of 2.98 +/-0.06 at 10GHz and a low dissipation factor (0.0018 at 10GHz, 0.0023 at 20GHz). With excellent heat resistance, low thermal expansion coefficient (CTE x-axis of 15 ppm/°C, CTE y-axis of 16 ppm/°C, CTE z-axis of 78 ppm/°C, -55°C to 288°C), high insulation resistance, and good thermal conductivity, it also pairs perfectly with reverse-treated RTF copper foil for optimal PIM performance (PIM value <-160 dbc), precise line control, and minimized conductor loss. The low thermal coefficient of Dk at -78 ppm/°C (-55°C to 150°C) and moisture absorption of 0.05% further enhance its reliability and durability.
Typical Applications
Due to its outstanding performance, this PCB is ideal for a wide range of applications. It is commonly used in aerospace equipment, microwave and RF systems, radar (especially military radar), feed networks, phase-sensitive and phased array antennas, as well as satellite communications.
Why Choose This PCB?
When you need a reliable, high-performance PCB for your advanced projects, this 2-layer F4BTME298 PCB is the perfect choice. Its superior material properties, precise construction, and wide range of applications make it stand out in the market. It adheres to strict quality standards and is available worldwide, ensuring you get the best product no matter where you are.
Tags: F4BTME298 PCB, 2-layer rigid PCB, 1.6mm thickness PCB, Immersion Tin PCB, high-performance PCB, aerospace PCB, microwave PCB, RF PCB, radar PCB, satellite communication PCB, low dissipation factor PCB, PTFE resin PCB
Order Now for Advanced Applications!
Don't miss out on the opportunity to enhance your projects with this 1.6mm F4BTME298 PCB. Order now and experience the difference in performance and reliability for your aerospace, microwave, radar, and communication applications!
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