8-Layer RO3003 Hybrid PCB with 94V0 for High-Frequency Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3003 (PTFE) + S1000-2m (Fr-4)
• Model NO.: BIC-1102-V3.0
• Material: RO3003 (PTFE) + S1000-2m (Fr-4)
• Application: Large Touch Panel
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Enig
• Base Material: RO3003 (PTFE) + S1000-2m (Fr-4)
• Insulation Materials: RO3003 (PTFE) + S1000-2m (Fr-4)
• Brand: Rogers/Shengyi
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 122.3mm x 94.4mm
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

The 8-layer RO3003 hybrid PCB combines Rogers high-frequency laminates with FR-4 for superior RF performance in 5G, automotive radar, and mmWave applications. Featuring blind vias and impedance control, this printed circuit board delivers stable signal integrity across temperature variations.

 

 

PCB Construction Details (Summary Table)

Parameter	Specification
Base Material	Rogers RO3003 ceramic-filled PTFE + S1000-2M High Tg170 FR-4
Layer Count	8 layers
Board Dimensions	122.3mm × 94.4mm (1PCS, ±0.15mm)
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.35mm
Via Types	Blind vias (L7-L8)
Finished Thickness	2.2mm
Copper Weight	0.5oz (inner), 1oz (outer)
Via Plating Thickness	20μm
Surface Finish	Immersion Gold
Silkscreen	White (Top & Bottom)
Solder Mask	Matt Black (Top & Bottom)
Silkscreen Restriction	Forbidden on solder pads
Testing	100% Electrical test
Impedance Control	50Ω single-ended (11mil), 100Ω differential (7mil/7mil)

 

Other Key Components & Features
Stackup:

• Copper layer 1 - 18 μm 
  Rogers 3003  Core - 0.127 mm 
  Copper layer 2 - 18 μm
  Prepreg FastRise 28 - 0.11 mm
  Copper layer 3 - 18 μm
  S1000-2M FR-4 - 0.66 mm 
  Copper layer 4 - 18 μm
  Prepreg - 0.11 mm
  Copper layer 5 - 18 μm
  S1000-2M FR-4 - 0.36 mm 
  Copper layer 6 - 35 μm
  Prepreg - 0.11 mm
  Copper layer 7 - 18 μm
  S1000-2M FR-4 - 0.36 mm 
  Copper layer 8 - 35 μm

• 
  PCB Statistics:
  Components:        81
  Total Pads:         143
  Thru Hole Pads:     61
  Top SMT Pads:      52
  Bottom SMT Pads:    30
  Vias:              247
  Nets:               26
   

Material Advantages:

• Dk 3.0 ±0.04 @10GHz

• Ultra-low loss (Df 0.001) up to 77GHz

• CTE-matched (X/Y: 17/16 ppm/°C)

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• Typical Applications:

• 77GHz automotive radar

• 5G mmWave antennas

• RF filters & oscillators

•  

Why Choose This PCB?

• 1.Hybrid design balances cost/performance

• 2.IPC-Class-2 reliability

• 3.Optimized for temperature-sensitive RF

•  

Tags:RF Circuit Board, Hybrid PCB, RO3003, mmWave Electronics

 

Order Now for:

High-frequency PCB manufacturing solutions in automotive/telecom electronics.
 

Additional Notes:

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide