High-Power RO4003c PCB - 1.6mm Double-Sided RF Board with 2oz Copper

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1032-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Power RO4003C PCB - 1.6mm Double-Sided RF Board with 2oz Copper
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Product Overview
This robust double-sided PCB utilizes Rogers RO4003C high-frequency laminate to deliver exceptional performance for demanding RF power applications. Designed for cellular infrastructure and automotive radar systems, this 1.6mm thick board features heavy 2oz copper layers (70μm) for enhanced current handling and thermal management, combined with immersion gold surface finish for reliable connectivity.

Key Advantages:
Superior Power Handling: 2oz copper layers support high-current applications
Excellent Signal Integrity: 3.38±0.05 dielectric constant with 0.0027 low loss
Thermal Efficiency: 0.71 W/m/K conductivity for heat dissipation
Manufacturing Economy: Processes like standard FR-4 with superior RF performance

2. Technical Specifications

Parameter	Specification
Base Material	Rogers RO4003C
Layer Configuration	Double-Sided
Board Dimensions	150.33mm × 155.41mm (±0.15mm)
Finished Thickness	1.6mm (1.524mm dielectric)
Copper Weight	2oz (70μm) both layers
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.35mm
Via Plating	25.4μm (1 mil)
Surface Finish	Immersion Gold
Component Density	176 components (444 total pads)

3. Engineering Features
Advanced Material Properties
Frequency Stability: Maintains consistent Dk across temperature variations
Environmental Resistance: Only 0.06% moisture absorption
Thermal Reliability: >280°C glass transition temperature
Dimensional Stability: CTE matched to copper (11/14 ppm/°C X/Y)

Design Capabilities
High-Power Layout: Supports 262 thru-hole components
Precision Manufacturing: 4/4 mil trace/space technology
Reliable Interconnects: 168 plated through holes
Global Availability: Worldwide manufacturing support


Target Applications
5G Infrastructure: Base station power amplifiers
Automotive Radar: 77GHz collision avoidance systems
Satellite Comms: High-power LNB modules
RFID Systems: Long-range identification tags

Why Choose This PCB?
1. Enhanced Current Capacity with 2oz copper construction
2. Cost-Effective Alternative to PTFE materials
3. Thermally Optimized for power applications
4. High-Yield Manufacturing with standard processes

Order Your Custom RF Solution
Contact our engineering team for specialized configurations tailored to your high-power requirements, supported by our global manufacturing network.




Thank you for your reading and you're welcome to contact us for your PCB enquiries.