8-Layer RO3003 High-Frequency PCB - 1.0mm Thick Multilayer RF Solution

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3003
• Model NO.: BIC-1031-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

8-Layer RO3003 High-Frequency PCB - 1.0mm Thick Multilayer RF Solution
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Advanced RF Circuit Board Overview
This sophisticated 8-layer PCB utilizes Rogers RO3003 ceramic-filled PTFE laminates to deliver exceptional performance for demanding millimeter-wave applications. Designed for 77GHz automotive radar and 5G infrastructure, this 1.0mm thick multilayer board features a complex blind via structure (L5-L8) and optimized impedance control for high-frequency signal integrity.

Key Advantages:
Ultra-Low Signal Loss: 0.001 dissipation factor at 10GHz
Thermal Stability: >500°C decomposition temperature
High-Density Design: 4/4 mil trace/space with 219 vias
Reliable Construction: Immersion gold finish with green solder mask

2. Technical Specifications

Parameter	Specification
Base Material	Rogers RO3003 PTFE Composite
Layer Configuration	8-Layer Multilayer
Board Dimensions	237mm × 70.1mm (±0.15mm)
Finished Thickness	1.0mm
Copper Weight	0.5oz inner / 1oz outer layers
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.4mm
Via Configuration	Blind vias (L5-L8)
Surface Finish	Immersion Gold
Component Density	190 components (248 total pads)

3. Engineering Features
Precision Stackup Architecture
Top Layer: 1oz copper + 0.127mm RO3003
Inner Layers: 0.5oz copper with 0.076mm bondply
Core Structure: Alternating RO3003 substrates
Bottom Layer: 1oz copper + 0.127mm RO3003

Material Excellence
Frequency Stability: 3.0±0.04 dielectric constant
Thermal Management: 0.5 W/m/K conductivity
Moisture Resistance: 0.04% absorption
Dimensional Stability: CTE matched to copper


Target Applications
Automotive Radar: 77GHz ADAS and collision avoidance
5G Infrastructure: mmWave base station components
Satellite Systems: High-frequency communication arrays
Military Electronics: Phased-array radar systems

Why Choose This PCB?
1. Millimeter-Wave Ready for 77GHz applications
2. High-Density Interconnects with blind via technology
3. Thermally Stable for harsh environments
4. Cost-Effective multilayer RF solution


Request Your Custom RF Solution
Our engineering team can develop specialized configurations for your millimeter-wave applications, with global manufacturing support and technical consultation.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.