High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing

Product Details
Customization: Available
Type: Flexible Circuit Board
Dielectric: PTFE Polyimide Glass Fabric Copper-Clad Laminates
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  • High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing
  • High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing
  • High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing
  • High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing
  • High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing
  • High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing
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Basic Info.

Model NO.
BIC-213-V3.0
Material
Tb-73 Polyimide
Application
Aerospace
Flame Retardant Properties
V0
Mechanical Rigid
Fexible
Processing Technology
Enepig
Base Material
Polyimide (Tb-73)
Insulation Materials
Tb-73 (Serving as The Dielectric Material)
Brand
Rogers
Designation
Tb-73
Surface Finish
OSP, Enepig
Copper Weight
1oz (35µm), 2oz (70µm)
Solder Mask
Green, Black, Blue, Red, Yellow
Transport Package
Express Box
Specification
400 mm x 500 mm
Trademark
bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)

 

Brief Introduction

The TB-73 Polyimide PCB is a high-performance circuit board designed to withstand extreme temperatures and high-frequency conditions, making it ideal for demanding industries such as aerospace, aviation, military, and underground petroleum exploration. This material offers excellent high-frequency dielectric properties, high-temperature resistance, and radiation resistance. With a nominal thickness range of 0.1mm to 10mm, TB-73 is a reliable choice for applications requiring durability and performance in harsh environments.


Chemical Test Report
TB-73 meets the technical conditions outlined in the Q/XA50089-2004 standard. The material has undergone rigorous testing to ensure its quality and performance:

Peel Strength After Thermal Stress: ≥1.0 N/mm (Actual: 1.42 N/mm) - Pass
Peel Strength at 170ºC: ≥0.7 N/mm (Actual: Pass)
Volume Resistivity: ≥5×10^6 MΩ·cm (Actual: 6.6×10^7 MΩ·cm) - Pass
Surface Resistivity: Within specified range (Actual: 3.4×10^7 MΩ and 2.3×10^8 MΩ) - Pass
Moisture Absorption Rate: ≤0.35% (Actual: 0.11%) - Pass
Breakdown Voltage: ≥40 kV (Actual: 44.3 kV) - Pass
Dielectric Constant at 1MHz: ≤4.5 (Actual: 4.12) - Pass
Dissipation Factor at 1MHz: ≤0.01 (Actual: 0.0072) - Pass
Bending Strength: ≥400 N/mm² (Machine Direction) and ≥300 N/mm² (Cross Direction) - Pass
Thermal Stress Resistance: Withstands 288ºC for 180 seconds without delamination or blistering - Pass
Glass Transition Temperature (Tg): 257ºC - Meets requirements

 
High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing
High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing

Our PCB Capability (TB-73 Polyimide RF PCB)
PCB material: Polyimide Glass Fabric Copper-clad Laminates
Designation: TB-73
Dielectric constant: 4.12
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 5mil (0.127mm), 10mil(0.254mm), 20mil (0.508mm), 30mil (0.762mm), 50mil (1.27mm), 60mil (1.524mm) etc.
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow etc.
Surface finish: Electroless Nickel and Immersion Gold (ENIG), HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), Pure gold plated etc..
 

About Bicheng

Bicheng PCB is a leading supplier of high-quality printed circuit boards (PCBs) based in Shenzhen, China. Established in 2003, the company has over 20 years of experience in the industry and has built a reputation for delivering reliable and cost-effective PCB solutions to customers worldwide.

 

Bicheng PCB's manufacturing capabilities cover a wide range of PCB types, including single-sided, double-sided, and multilayer boards, with layer counts ranging from 1 to 32. The company's PCBs are used in various industries, including telecommunications, aerospace, defense, medical, and industrial electronics.

 

Bicheng PCB offers a wide range of substrate materials, including high-frequency materials such as RO4003C, RO4350B, and RO4730G3, as well as standard FR-4 materials like high-Tg S1000-2MTU-872 SLK, TU-768, IT-180A, and Isola 370HR. The company also provides metal core, polyimide, and PET substrates, among others.


Advanced Manufacturing Capabilities:
Board Size: Up to 1100mm x 600mm
Board Outline Tolerance: ±0.0059" (0.15mm)
Thickness Tolerance: ±8% for T≥0.8mm and ±10% for T<0.8mm
Copper Thickness: 17µm to 350µm (0.5oz to 10oz)
Drill Hole Diameter: 0.0079" to 0.25" (0.2mm to 6.35mm)

Bicheng PCB is committed to quality and customer satisfaction, as reflected in its ISO 9001:2015 certification. The company's experienced engineers and technicians work closely with customers to ensure their specific requirements are met, delivering PCBs on time and within budget.

Appendix: Data Sheet (TB-73 Laminates)
Specifications: 1240×630×0.5mm 1/1          
Technical Conditions: Q/XA50089-2004          
No. Item Processing Condition Standard Specification Test Results Conclusion
1 Peel Strength (N/mm) After Thermal Stress ≥1.0 1.42 Pass
170ºC ≥0.7 Pass Pass
After Process Solution ≥0.95 1.13 Pass
2 Volume Resistivity                 (MΩ·cm) C-96/35/90 ≥5×10^6 6.6×10^7 Pass
E-24/204 ≥5×10^6 6.2×10^8 Pass
3 Surface Resistivity (MΩ) C-96/35/90 ≥1×10^6 3.4×10^7 Pass
E-24/204 ≥1×10^6 2.3×10^8 Pass
4 Moisture Absorption Rate( %) D-24/23 ≤0.35% 0.11 Pass
5 Breakdown Voltage (kV) D-48/50+ D-0.5/23 ≥40 kV 44.3 Pass
6 Dielectric Constant at 1MHz As Received ≤4.5 4.12 Pass
7 Dissipation Factor at 1MHz As Received ≤0.01 0.0072 Pass
8 Bending Strength                Machine Direction                     Cross Direction As Received ≥400 N/mm² 410.2 Pass
As Received ≥300 N/mm² 355.1 Pass
9 Thermal Stress (288ºC) As Received 180s, no delamination, no blistering Pass Pass
10 Glass Transition Temperature (Tg Value) As Received 257ºC Pass Pass
High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing
High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing
High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing

 

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