High-Temperature Resistant Advanced Polyimide electronic PCB Board Manufacturing

• Customization: Available
• Type: Flexible Circuit Board
• Dielectric: PTFE Polyimide Glass Fabric Copper-Clad Laminates
• Model NO.: BIC-213-V3.0
• Material: Tb-73 Polyimide
• Application: Aerospace
• Flame Retardant Properties: V0
• Mechanical Rigid: Fexible
• Processing Technology: Enepig
• Base Material: Polyimide (Tb-73)
• Insulation Materials: Tb-73 (Serving as The Dielectric Material)
• Brand: Rogers
• Designation: Tb-73
• Surface Finish: OSP, Enepig
• Copper Weight: 1oz (35µm), 2oz (70µm)
• Solder Mask: Green, Black, Blue, Red, Yellow
• Transport Package: Express Box
• Specification: 400 mm x 500 mm
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)

 

Brief Introduction

The TB-73 Polyimide PCB is a high-performance circuit board designed to withstand extreme temperatures and high-frequency conditions, making it ideal for demanding industries such as aerospace, aviation,and underground petroleum exploration. This material offers excellent high-frequency dielectric properties, high-temperature resistance, and radiation resistance. With a nominal thickness range of 0.1mm to 10mm, TB-73 is a reliable choice for applications requiring durability and performance in harsh environments.

Chemical Test Report
TB-73 meets the technical conditions outlined in the Q/XA50089-2004 standard. The material has undergone rigorous testing to ensure its quality and performance:

Peel Strength After Thermal Stress: ≥1.0 N/mm (Actual: 1.42 N/mm) - Pass
Peel Strength at 170ºC: ≥0.7 N/mm (Actual: Pass)
Volume Resistivity: ≥5×10^6 MΩ·cm (Actual: 6.6×10^7 MΩ·cm) - Pass
Surface Resistivity: Within specified range (Actual: 3.4×10^7 MΩ and 2.3×10^8 MΩ) - Pass
Moisture Absorption Rate: ≤0.35% (Actual: 0.11%) - Pass
Breakdown Voltage: ≥40 kV (Actual: 44.3 kV) - Pass
Dielectric Constant at 1MHz: ≤4.5 (Actual: 4.12) - Pass
Dissipation Factor at 1MHz: ≤0.01 (Actual: 0.0072) - Pass
Bending Strength: ≥400 N/mm² (Machine Direction) and ≥300 N/mm² (Cross Direction) - Pass
Thermal Stress Resistance: Withstands 288ºC for 180 seconds without delamination or blistering - Pass
Glass Transition Temperature (Tg): 257ºC - Meets requirements
 

Our PCB Capability (TB-73 Polyimide RF PCB)

PCB material:	Polyimide Glass Fabric Copper-clad Laminates
Designation:	TB-73
Dielectric constant:	4.12
Layer count:	Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness:	5mil (0.127mm), 10mil(0.254mm), 20mil (0.508mm), 30mil (0.762mm), 50mil (1.27mm), 60mil (1.524mm) etc.
Copper weight:	1oz (35µm), 2oz (70µm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Red, Yellow etc.
Surface finish:	Electroless Nickel and Immersion Gold (ENIG), HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), Pure gold plated etc..

 

About Bicheng

Bicheng PCB is a leading supplier of high-quality printed circuit boards (PCBs) based in Shenzhen, China. Established in 2003, the company has over 20 years of experience in the industry and has built a reputation for delivering reliable and cost-effective PCB solutions to customers worldwide.

 

Bicheng PCB's manufacturing capabilities cover a wide range of PCB types, including single-sided, double-sided, and multilayer boards, with layer counts ranging from 1 to 32. The company's PCBs are used in various industries, including telecommunications, aerospace, defense, medical, and industrial electronics.

 

Bicheng PCB offers a wide range of substrate materials, including high-frequency materials such as RO4003C, RO4350B, and RO4730G3, as well as standard FR-4 materials like high-Tg S1000-2M, TU-872 SLK, TU-768, IT-180A, and Isola 370HR. The company also provides metal core, polyimide, and PET substrates, among others.

Advanced Manufacturing Capabilities:
Board Size: Up to 1100mm x 600mm
Board Outline Tolerance: ±0.0059" (0.15mm)
Thickness Tolerance: ±8% for T≥0.8mm and ±10% for T<0.8mm
Copper Thickness: 17µm to 350µm (0.5oz to 10oz)
Drill Hole Diameter: 0.0079" to 0.25" (0.2mm to 6.35mm)
Bicheng PCB is committed to quality and customer satisfaction, as reflected in its ISO 9001:2015 certification. The company's experienced engineers and technicians work closely with customers to ensure their specific requirements are met, delivering PCBs on time and within budget.

Appendix: Data Sheet (TB-73 Laminates)

Specifications: 1240×630×0.5mm 1/1
Technical Conditions: Q/XA50089-2004
No.	Item	Processing Condition	Standard Specification	Test Results	Conclusion
1	Peel Strength (N/mm)	After Thermal Stress	≥1.0	1.42	Pass
		170ºC	≥0.7	Pass	Pass
		After Process Solution	≥0.95	1.13	Pass
2	Volume Resistivity                 (MΩ·cm)	C-96/35/90	≥5×10^6	6.6×10^7	Pass
		E-24/204	≥5×10^6	6.2×10^8	Pass
3	Surface Resistivity (MΩ)	C-96/35/90	≥1×10^6	3.4×10^7	Pass
		E-24/204	≥1×10^6	2.3×10^8	Pass
4	Moisture Absorption Rate( %)	D-24/23	≤0.35%	0.11	Pass
5	Breakdown Voltage (kV)	D-48/50+ D-0.5/23	≥40 kV	44.3	Pass
6	Dielectric Constant at 1MHz	As Received	≤4.5	4.12	Pass
7	Dissipation Factor at 1MHz	As Received	≤0.01	0.0072	Pass
8	Bending Strength                Machine Direction                     Cross Direction	As Received	≥400 N/mm²	410.2	Pass
		As Received	≥300 N/mm²	355.1	Pass
9	Thermal Stress (288ºC)	As Received	180s, no delamination, no blistering	Pass	Pass
10	Glass Transition Temperature (Tg Value)	As Received	257ºC	Pass	Pass