Multilayer PCB Built on MID-Tg Fr4 V-Cut in Panel Form

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-990-V9.90
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Board Thick
1.6mm
Surface Finish
Immersion Gold
out Layer Copper
1 Oz
Soldermask Color
Green
Silkscreen Color
No Required
Minimum Trace and Space
7.6 Mil/ 5.2 Mil
Minimum / Maximum Holes
0.8 mm /1.3 mm
Via
Minimum Size 0.8mm
Board Plating
0.0029
Test
100% Electrical Test
Transport Package
Vacuum
Specification
213mm x 246mm =44pcs
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000 PCS/ Month

Product Description

1.1 General description

This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of
Monitoring Systems. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo)
and immersion gold on pads. The base material is from ITEQ supplying 44 up PCBs per panel.
They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed
for shipment. 

1.2 Features and benifits    
    
a. Outstanding thermal resistance and suitable for lead-free process
b. Long storage time ( It can be stored for more than 1 year in vacuum bag)
c. Good shielding effect
d. Engineering design prevents problems from occurring in pre production. 
e. Electrical test and  high voltage test
f.  Eligible products rate of first production: >95%  
g. ISO9001, ISO14001, TS16949, UL Certified

1.3 Application

WiFi Antenna, Satellite Phone, Portable Sound System, DC To AC Inverter, WiFi 3G, Car
Trackers, AC To AC Converter, GPS Asset Tracking, Tower-Mounted Booster, Instrumentation    
    
1.4 Parameter and data sheet
PCB SIZE 213 x 246mm=44 PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
Prepreg 7628(41%) 0.185 mm
copper ------- 35um(1oz) MidLayer 1
FR-4 1.1 mm
copper ------- 35um(1oz) MidLayer 2
Prepreg 7628(41%) 0.185 mm
copper ------- 18um(0.5oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 7.6 mil/ 5.2 mil
Minimum / Maximum Holes: 0.8 mm /1.3 mm
Number of Different Holes: 3
Number of Drill Holes: 56
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  FR-4 Tg150ºC, er<5.4.IT-158,  ITEQ Supplied
Final foil external:  1 oz
Final foil internal:  1 oz
Final height of PCB:  1.6 mm ±0.16
PLATING AND COATING  
Surface Finish Immersion gold (15.73% ) 0.05 µm over 3 µm nickel
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, V-cut
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA plated through hole(PTH), minimum size 0.8mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

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