Laser Stencil for SMT Solder Paste Process with 0.1mm Foil

• Customization: Available
• Metal Coating: Tin
• Mode of Production: SMT
• Model NO.: BIC-0428-v4.28
• Layers: Double-Layer
• Base Material: Stainless Steel Shim
• Certification: RoHS, ISO
• Customized: Customized
• Condition: New
• Foil Thickness: 0.1mm
• Structure: Stencil Foils with Aluminum Frame
• Board Material: Stainless Steel Shim
• Aperture: Laser Cut
• Appearance: Engraving and Electro Polishing
• Fiducial Mark: Through Hole
• Application: Csp, BGA, 0.5mm Qfp etc. Package
• Transport Package: Vacuum
• Specification: 520 mm x 420 mm x 20mm =1 PCS
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 7314200000
• Production Capacity: 50000 PCS/ Month

Product Description

Product profile

1.1 General description

This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless
steel foil with aluminum frame 520 mm x 420 mm x 20mm dimension. It's fabricated
per IPC 7525A using supplied Gerber data, squeegee area locating in the center.
Fiducal marks are through holes to suit for the SMT machine. It's packed with KK
carton (hard card) and usually 2 stencils are packed for shipment.

1.2 Features and benifits 
   
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process
     error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to
     the printing and forming of tin paste;
D. Engineering design prevents problems from occurring in pre production;
E. Comprehensive equipment management and maintenance and process control;
F.  Diversified shipping method;
G. Professional and experienced engineers;
H. Competitive price;
I.   Eligible products rate of first production: >99.99%  
J.  More than 9000 types per month;

1.3 Application

SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip

1.4 Parameter and data sheet

Dimension:	370mm x 470mm, 420mm x 520mm, 550mm x 650mm
Structure	Stencil foils with aluminum frame
Base material	Stainless steel shim
Foil Thickness	0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm,  0.15mm, 0.18mm, 0.2mm
Aperture configured	Laser cut
Appearance	Engraving and electro polishing
Fiducial mark	Through hole
Service area:	Worldwide
Quantity of open pads:	1235
Advantages:	a) High precision dimension; b) Good shape on the window;  c) Hole wall is smoother.
Application:	CSP, BGA, 0.5mm QFP etc. package

1.5 Opening Hole Design for Stencil

Component  Type	Pitch	Soldering Width	Soldering  Length	Opening Width	Opening  Length	Shim Thickness
PLCC	1.27mm	0.65mm	2.00mm	0.60mm	1.95mm	0.15-0.25mm
QFP	0.635mm	0.35mm	1.50mm	0.32mm	1.45mm	0.15-0.18mm
QFP	0.50mm	0.254-0.33mm	1.25mm	0.22-0.25mm	1.20mm	0.12-0.15mm
QFP	0.40mm	0.25mm	1.25mm	0.20mm	1.20mm	0.10-0.12mm
QFP	0.30mm	0.20mm	1.00mm	0.15mm	0.95mm	0.07-0.12mm
0402		0.50mm	0.65mm	0.45mm	0.60mm	0.12-0.15mm
0201		0.25mm	0.40mm	0.23mm	0.35mm	0.07-0.12mm
BGA	1.27mm	0.80mm		0.75mm	0.75mm	0.15-0.20mm
BGA	1.00mm	0.38mm		0.35mm	0.35mm	0.10-0.12mm
BGA	0.50mm	0.30mm		0.28mm	0.28mm	0.07-0.12mm
Flip Chip	0.25mm	0.12mm	0.12mm	0.12mm	0.12mm	0.08-0.10mm
Flip Chip	0.20mm	0.10mm	0.10mm	0.10mm	0.10mm	0.05-0.10mm