HDI 16 Layer Stackups for Large Dense BGA PCB

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC1289R1.3
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Surface Finish
Immersion Gold
Solder Mask Color
Green
Silkscreen Color
White
Copper Thickness
1 Oz
Board Thickness
2.4mm
Minimum Trace and Space
4.5 Mil/4.5 Mil
Minimum/Maximum Holes
0.36/2.5mm
Via
Via in Pad
Board Plating
0.0030"
Test
Electrical Test
Transport Package
Vacuum
Specification
260 x 165mm=1PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534001000
Production Capacity
50000 PCS/ Month

Product Description

Prototype board Service 16 Layer Multilayer PCB Via in Pad Technical Skill FR-4 At 2.4mm
Thick Applied In Communication Systems

 
Commodity Introduction
This is a type of FR-4 PCB for the application of Communication Systems It's a 16 layer board
at 2.4mm thick. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are
packed separately. 


Parameters & Data Sheet
PCB SIZE 260 x 165mm=1PCS=1design
BOARD TYPE  
Number of Layers Multilayer PCB, 16 Layer PCB
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- TOP   17um(1oz)+plate 25um
65 um prepreg 1080 x 1
copper ------- L02   35um(1oz)
150um core FR-4
copper ------- L03   35um(1oz)
65 um prepreg 1080 x 1
copper ------- L04   35um(1oz)
150um core FR-4
copper ------- L05   35um(1oz)
65 um prepreg 1080 x 1
copper ------- L06   35um(1oz)
150um core FR-4
copper ------- L07   35um(1oz)
65 um prepreg 1080 x 1
copper ------- L08   35um(1oz)
150um core FR-4
copper ------- L09   35um(1oz)
65 um prepreg 1080 x 1
copper ------- L10   35um(1oz)
150um core FR-4
copper ------- L11   35um(1oz)
65 um prepreg 1080 x 1
copper ------- L12   35um(1oz)
150um core FR-4
copper ------- L13   35um(1oz)
65 um prepreg 1080 x 1
copper ------- L14   35um(1oz)
150um core FR-4
copper ------- L15   35um(1oz)
65 um prepreg 1080 x 1
copper ------- BOT   17um(0.5oz)+plate 25um
TECHNOLOGY  
Minimum Trace and Space: 4.5mil/4.5mil
Minimum / Maximum Holes: 0.36/2.5mm
Number of Different Holes: 13
Number of Drill Holes: 2519
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL  
Glass Epoxy:  FR-4, ITEQ IT-180, Tg >170, er<5.4
Final foil external:  1oz
Final foil internal:  1oz
Final height of PCB:  2.4mm ±10%
PLATING AND COATING  
Surface Finish Electroless nickel over Immersion Gold (ENIG)( 0.05µm  over 3µm nickel)
Solder Mask Apply To:  Top and Bottom, 12micon Minimum.
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo supplied. 
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and 
leged FREE AREA
VIA Plated Through Hole(PTH), via tented. 
Via in pad
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
APPLICATION: Communication systems, Switch Mode 
Power Supply
Switch Board
Frequency Converter
RF Module
Motor Driver
TYPE OF ARTWORK 
TO BE SUPPLIED
email file, Gerber RS-274-X, PCBDOC etc


Fast PCB prototypes
Category Fastest lead time Stanardard lead time
2 layer 24 hrs 4 days
4 layer 48 hrs 5 days
6 layer 72 hrs 7 days
8 layer 96 hrs 9 days
10 layer 120 hrs 11 days
12 layer 120 hrs 12 days
14 layer 144 hrs 15 days
16-20 layer Depends on specifications
20 layer above Depends on specifications


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