Rogers Cuclad 217 PCB, 2-Layer RF PCB, 0.3mm Thin PCB, Immersion Silver Finish, Microwave Circuit Board, Radar System PCB, Low Dk PCB

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Cuclad 217
• Model NO.: BIC-1209-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Frequency 2-Layer Rogers CuClad 217 PCB - 0.3mm Thin, 6/5 Mils Trace/Space, Immersion Silver Finish for RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)



1. Product Overview
This ultra-thin 2-layer RF PCB utilizes Rogers CuClad 217 laminate to deliver exceptional high-frequency performance with low signal loss and stable dielectric properties. Designed for radar systems, microwave components, and sensitive RF circuits, this 0.3mm thin PCB features 6/5 mils trace/space precision and immersion silver finish for optimal signal integrity.

Key Features:
Ultra-Low Loss: Dk=2.17±0.03 with dissipation factor of 0.0009 @ 10GHz

Thin Profile: Just 0.3mm total thickness for space-constrained designs

High-Frequency Optimized: Supports microwave and millimeter-wave applications

Excellent Dimensional Stability: Cross-plied fiberglass construction for mechanical isotropy

Reliable Surface Finish: Immersion silver for superior RF performance


2. Technical Specifications

Parameter	Specification
Base Material	Rogers CuClad 217
Layer Count	2-layer rigid
Board Dimensions	106.8×51.8mm ±0.15mm
Trace/Space	6/5 mils minimum
Minimum Hole	0.35mm
Thickness	0.3mm total
Copper Weight	1oz (35μm)
Via Plating	20μm
Surface Finish	Immersion Silver
Solder Mask	None (Bare)
Silkscreen	None
Testing	100% electrical test

Stackup Structure:
Top Copper: 35μm

Core: 0.254mm (10mil) CuClad 217

Bottom Copper: 35μm



3. Design & Performance Characteristics

Material Advantages:
Ultra-Low Loss Tangent: 0.0009 @ 10GHz

Moisture Resistance: 0.02% absorption

Mechanical Stability: Cross-plied fiberglass construction

Peel Strength: 14 lbs/in for reliable copper adhesion

Space-Qualified: Low outgassing (TML 0.01%, CVCM 0.01%)


Electrical Properties:
Dielectric Constant: 2.17±0.03

Frequency Stability: Stable Dk from 1MHz to 10GHz

Insertion Loss: Ultra-low for high-frequency signals


Design Specifications:
Components: 27
Pads: 103 (78 thru-hole, 25 SMT)
Vias: 15
Nets: 2
Artwork: Gerber RS-274X
Quality Standard: IPC-Class 2


4. Typical Applications
Radar Systems: Phased array, surveillance radar

Electronic Warfare: ECM, ESM systems

Microwave Components: LNAs, filters, couplers

Aerospace & Defense: Avionics, satellite communications

5G Infrastructure: mmWave base station components

Test & Measurement: High-frequency probes


5. Why Choose This PCB?
1. Industry-Leading RF Performance with Dk=2.17
2. Ultra-Thin 0.3mm Profile for compact designs
3. Precision 6/5 mils Trace/Space for high-density layouts
4. Immersion Silver Finish for optimal high-frequency performance
5. IPC-Class 2 Certified for reliable quality



Order Now for High-Frequency Solutions!
Contact us for custom designs or request a quote - ideal for demanding RF and microwave applications requiring stable, low-loss performance.




Thank you for your reading and you're welcome to contact us for your PCB enquiries.