Flexible PCB, 0.13mm Polyimide FPC, 1-Layer Flex Circuit, Enig Finish FPC, Yellow Coverlay Flex PCB, High-Frequency Flexible PCB, Sf201 Polyimide Material

• Customization: Available
• Structure: Single-Sided FPC
• Material: Polyimide
• Model NO.: BIC-1208-V1.0
• Combination Mode: Without Adhesive Flexible Plate
• Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
• Conductive Adhesive: Anisotropic Conductive Adhesive
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Polyimide
• Brand: Polyimide
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Ultra-Thin Polyimide FPC - 0.13mm 1-Layer Flexible PCB with 4/4 Mils Trace/Space, Yellow Coverlay & ENIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Product Overview
This ultra-thin 1-layer flexible PCB utilizes high-performance polyimide SF201 material for exceptional flexibility and reliability in compact electronic devices. With a remarkable 0.13mm thickness and 4/4 mils trace/space capability, it's ideal for space-constrained applications requiring repeated bending. The immersion gold (ENIG) surface finish ensures excellent solderability, while the yellow polyimide coverlay provides durable protection.

Key Features:
Extreme Flexibility: >5000 folding cycles for dynamic applications

High-Frequency Performance: Dk=3.5 @ 10GHz with low loss (Df=0.0059)

Ultra-Thin Profile: Just 0.13mm total thickness

Reliable Construction: UL94 V-0 flammability rating and RoHS compliance

Precision Manufacturing: 4/4 mils trace/space, 0.3mm minimum holes


2. Technical Specifications

Parameter	Specification
Base Material	Polyimide SF201
Layer Count	1-layer flexible
Board Dimensions	200×150mm (15-up panel) ±0.15mm
Trace/Space	4/4 mils minimum
Minimum Hole	0.3mm
Thickness	0.13mm total
Copper Weight	1oz (35μm)
Surface Finish	Immersion Gold (ENIG)
Coverlay	Yellow (Top & Bottom)
Silkscreen	White (Top only)
Testing	100% electrical test

Stackup Structure:
Coverlay: Yellow Polyimide

Copper: 35μm (1oz)

Base: 25μm Polyimide SF201


3. Design & Performance Characteristics
Material Advantages:

Excellent Flexibility: Withstands >5000 bending cycles

Thermal Stability: Continuous service up to 260°C

Chemical Resistance: >90% against common solvents

Dimensional Stability: Low CTE for precise alignment

Peel Strength: 1.27N/mm for reliable adhesion


Electrical Properties:
Dielectric Constant: 3.5 @ 10GHz

Dissipation Factor: 0.0059 @ 10GHz

Insulation Resistance: >10⁸Ω

Design Specifications:
Components: 17
Pads: 23 (all SMT)
Nets: 1
Vias: None
Artwork: Gerber RS-274X
Standard: IPC-Class 2


4. Typical Applications
Consumer Electronics: Smartphones, tablets, wearables

Display Technologies: OLED, LCD flex circuits

Computer Peripherals: HDD flex cables, printers

Automotive Electronics: Dashboard displays, sensors

Medical Devices: Wearable monitors, endoscopic cameras

Industrial Equipment: Robotics, control systems


5. Why Choose This FPC?
1. Superior Flexibility for dynamic bending applications
2. Ultra-Thin 0.13mm Profile saves space in compact designs
3. High-Frequency Capable up to 10GHz
4. Reliable ENIG Finish for excellent solderability
5. UL94 V-0 Rated for safety-critical applications


Order Now for Flexible Circuit Solutions!
Contact us for custom designs or request a quote - ideal for applications demanding thin, bendable, and reliable PCBs.



Thank you for your reading and you're welcome to contact us for your PCB enquiries.