Rt/Duroid 6010.2lm 2-Layer 0.8mm High-Dk PCB with Blue Solder Mask & White Silkscreen - Precision 50Ω Impedance Controlled RF Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rt/Duroid 6010.2lm
• Model NO.: BIC-1116-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RT/duroid 6010.2LM 2-Layer 0.8mm High-Dk PCB with Blue Solder Mask & White Silkscreen - Precision 50Ω Impedance Controlled RF Board
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Premium High-Frequency PCB Solution
At Bicheng Technologies, we present our advanced RT/duroid 6010.2LM 2-layer PCB, engineered for demanding microwave applications requiring ultra-high dielectric constant (Dk=10.2) performance.

This 0.8mm thick circuit board features:
Precision 50Ω impedance control on 14/10 mil coplanar waveguide structures
Superior high-frequency characteristics with remarkably low loss (tanδ=0.0023 @10GHz)
Exceptional dimensional stability (CTE 24/24/47 ppm/°C)
Military-grade reliability with >500°C thermal decomposition threshold

Ideal for compact RF designs where space is at a premium, this solution delivers 30-40% size reduction compared to standard materials while maintaining outstanding electrical performance.


2. Enhanced Construction Specifications

Parameter	Bicheng's Specification
Base Material	Rogers RT/duroid 6010.2LM (certified)
Board Dimensions	34×18mm (±0.15mm)
Layer Count	2-layer rigid construction
Finished Thickness	0.8mm (0.635mm core)
Copper Weight	1oz (35μm) both sides
Trace/Space	14/10 mils (controlled impedance)
Minimum Hole Size	0.25mm (mechanical drill)
Via Plating	20μm minimum
Surface Finish	Immersion Gold (ENIG)
Solder Mask	Top: Blue; Bottom: None
Silkscreen	Top: White; Bottom: None
Impedance Control	50Ω ±5% (coplanar waveguide)
Quality Standard	IPC-Class-2 with 100% testing

3. Technical Features & Applications
Stackup Architecture:

Top Layer: 35μm Cu + ENIG (blue mask/white silkscreen)

Core: 0.635mm RT/duroid 6010.2LM (Dk=10.2)

Bottom Layer: 35μm Cu (unmasked)


Design Specifications:

Components: 10 devices (15 SMT/12 thru-hole)

Interconnects: 16 vias (0.25mm)

Signal Paths: 2 controlled impedance nets

Panel Utilization: Individual units (34×18mm)


Material Advantages:

Ultra-Low Moisture Absorption: 0.01% for harsh environments

Exceptional Dk Stability: ±0.25 tolerance at 10GHz

Thermal Reliability: Withstands lead-free reflow processes

Manufacturing Consistency: Tight thickness control (±0.05mm)


Typical Applications:

Satellite Comms: Compact patch antennas for LEO constellations

Defense Systems: Radar warning receivers

5G Infrastructure: mmWave front-end modules

Avionics: TCAS antenna arrays


Why Choose This Solution?

Space-Saving Design: High Dk enables miniaturization

Guaranteed Impedance: ±5% tolerance on 50Ω lines

Premium Finish: Durable blue solder mask with white markings

Fast Turnaround: Prototypes in 5 days, production in 2 weeks


Start Your High-Frequency Design
Contact Sally for technical consultation or to request DfM guidelines. Prototype lead times as fast as 5 business days available.

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Thank you for your reading and you're welcome to contact us for your PCB enquiries.