| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Tg175°c Fr-4 |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
General Description
This essay outlines an 8-layer printed circuit board (PCB) constructed on a Tg175°C FR-4 substrate, specifically designed for satellite radio applications. The PCB has a thickness of 1.6 mm and features a white silkscreen (Taiyo) on a green solder mask (Taiyo) with immersion gold on the pads. The base material is sourced from Taiwan's ITEQ, providing one PCB per panel. It incorporates HDI structures from the top layer to inner layer 2, as well as buried vias connecting inner layer 2 to inner layer 4. The fabrication complies with IPC 6012 Class 2 standards using provided Gerber data, with each shipment containing 25 panels.
Features and Benefits
High Tg Materials: RoHS compliant and suitable for high thermal reliability needs.
Immersion Gold Finish: Offers excellent solderability, reduces stress on circuit boards, and minimizes contamination of the PCB surface.
On-Time Delivery: Achieves a higher than 98% on-time delivery rate.
Production Capacity: Capable of producing 30,000 m² per month.
Expertise: Over 18 years of experience in PCB manufacturing.
Robust Capabilities: Supports research and development, sales, and marketing initiatives.
Flexible Designs: Supports any layer HDI PCBs.
International Approvals: Meets global industry standards.
PCB Specifications
| PCB SIZE | 215 x 212mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 8 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Prepreg 7628(43%) 0.195mm | |
| copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 2 | |
| Prepreg 7628(43%) 0.195mm | |
| copper ------- 35um(1oz) MidLayer 3 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 4 | |
| Prepreg 7628(43%) 0.195mm | |
| copper ------- 35um(1oz) MidLayer 5 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 6 | |
| Prepreg 7628(43%) 0.195mm | |
| copper ------- 18um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.3/3.2mm |
| Number of Different Holes: | 18 |
| Number of Drill Holes: | 11584 |
| Number of Milled Slots: | 2 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 TG170ºC, er<5.4.IT-180, ITEQ Supplied |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (32.1% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000 KX700G, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, stamp holes. |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Typical Applications
WiFi Range Extenders
CCTV Systems
Satellite Communication
5G Technology
Router WiFi for 4G
Solar Panel Inverters
GPS Tracking Systems
Embedded Processors
PLC Programs
Phone Systems
Glass Transition Temperature (Tg)
The glass transition temperature (Tg) of the resin system is a critical thermal property, typically expressed in °C. For commonly used epoxy resins (FR-4 grade), Tg ranges from 115°C to 130°C. Exceeding Tg during soldering can lead to expansion in the Z-axis, which may stress the copper in plated-through holes. High Tg PCBs, defined as those with Tg ≥ 170°C, are specifically designed to mitigate this risk.
Manufacturing Process of Multi-layer PTH PCB (Via Filled)
Material Shearing
Inner Layer Dry Film Application
Inner Layer Etching
AOI Inspection 1
Black Oxidation
Milling Outline Frame
Inner Layer Drilling
PTH Process 1
Inner Layer Dry Film
Pattern Plating 1
Via Filling
Outer Layer Drilling
PTH Process 2
Pattern Plating 2
Outer Layer Dry Film Application
Copper-Tin Electro-Plating
Peeling and Etching
AOI Inspection 2
Solder Mask Applicat
ion Silkscreen Printing
Surface Finishing
Electrical Testing
Profile Contouring
Final Quality Control (FQC)
Packaging
Delivery
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