High-Frequency 4-Layer Tly-5 PCB – 1.2mm Thickness with Immersion Gold Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Tly-5
• Model NO.: BIC-1022-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Brand: Rogers/Taconic/Wangling
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Frequency 4-Layer TLY-5 PCB - 1.2mm Thickness with Immersion Gold Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Product Overview
This advanced 4-layer PCB utilizes TLY-5 laminate, a lightweight woven fiberglass material engineered for millimeter-wave applications up to 77GHz. Designed for automotive radar and satellite communications, this 1.2mm thick board features an immersion gold finish and blind vias (L1-L2) for optimal signal integrity in high-frequency designs.

Key Advantages:
Ultra-low signal loss: 0.0009 dissipation factor at 10GHz
Millimeter-wave ready: Stable 2.2±0.02 dielectric constant
Precision interconnects: Blind vias for high-density routing
Reliable construction: Matte black solder mask with white silkscreen

2. PCB Specifications

Parameter	Specification
Material	TLY-5 Woven Fiberglass
Layer Count	4 Layers
Dimensions	157mm × 112mm (2-up panel)
Thickness	1.2mm
Copper Weight	1oz (35μm) all layers
Min Trace/Space	9/9 mils
Min Hole Size	0.4mm
Via Configuration	Blind vias (L1-L2)
Surface Finish	Immersion Gold
Solder Mask	Matte Black (Top & Bottom)
Dielectric Constant	2.2±0.02 @ 10GHz

3. Technical Features
Advanced Stackup Design
Top Layer: 35μm copper (20mil TLY-5 dielectric)
Internal Layer 1: Signal routing
Internal Layer 2: Ground plane (0.1mm FastRise-28 prepreg)
Bottom Layer: 35μm copper (20mil TLY-5 dielectric)

Performance Benefits
Exceptional Dimensional Stability: Woven fiberglass construction
Moisture Resistance: Only 0.02% absorption
High-Frequency Optimization: Ideal for 77GHz automotive radar
Component Support: 80 components (59 thru-hole, 38 SMT)

Target Applications
Automotive Radar: 77GHz collision avoidance systems
Satellite Comms: LNBs and LNAs for broadcast reception
5G Infrastructure: Millimeter-wave base stations
Aerospace: Avionics and communication systems


Why Choose This PCB?
1. Industry-leading low loss tangent for millimeter-wave apps
2. Blind via technology enables complex 4-layer designs
3. Exceptional Dk stability across frequency ranges
4. Matte black solder mask reduces stray reflections

Engineered for Critical RF Challenges
Contact our engineering team for design support or immediate production quotes. This solution delivers uncompromising performance for the most demanding microwave and defense applications.
Thank you for your reading and you're welcome to contact us for your PCB enquiries.