Rogers RO3210/RO3003 3-Layer 3.0mm PCB for Automotive & RF Applications - 1oz Copper with Immersion Tin
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Overview of this Type of PCB
This 3-layer rigid PCB features a hybrid construction with Rogers RO3210 and RO3003 PCB materials, designed for high-reliability automotive and RF applications. The Hybrid PCB board measures 62.8mm x 62.8mm (tolerance ±0.15mm) with a finished thickness of 3.0mm, incorporating 1oz (1.4 mils) outer layer copper and 20μm via plating. It undergoes 100% electrical testing before shipment, ensuring performance in demanding environments. The surface finish is immersion tin, with no silkscreen or solder mask on either layer, optimizing it for specialized circuitry.
2. PCB Construction Details (Table)
| Parameter |
Detail |
| Base Material |
RO3210 / RO3003 |
| Layer Count |
3 layers |
| Board Dimensions |
62.8mm x 62.8mm (±0.15mm) |
| Minimum Trace/Space |
7/9 mils |
| Minimum Hole Size |
0.4mm |
| Blind Vias |
None |
| Finished Board Thickness |
3.0mm |
| Finished Cu Weight |
1oz (1.4 mils) outer layers |
| Via Plating Thickness |
20 μm |
| Surface Finish |
Immersion Tin |
| Top/Bottom Silkscreen |
No |
| Top/Bottom Solder Mask |
No |
| Electrical Test |
100% prior to shipment |
3. Other Key Components & Features
Additional Components & Specifications:
The PCB includes 21 components, 47 total pads (35 thru-hole, 12 top SMT), and 24 vias across 4 nets. It adheres to IPC-Class-2 quality standards, uses Gerber RS-274-X artwork, and is available worldwide.
PCB Stackup Structure:
-
- Copper_layer_1: 35 μm
- Rogers RO3003 Core: 1.524 mm (60mil)
- RO4450F Bondply: 0.101mm (4mil)
- Copper_layer_2: 35 μm
- Rogers RO3210 Core: 1.27 mm (50mil)
- Copper_layer_3: 35 μm
Material Advantages
RO3210 PCB Features:
- Dielectric constant (Dk) of 10.2 ±0.5 with dissipation factor 0.0027 at 10GHz.
- CTE matched to copper (x/y: 13ppm/°C, z: 34ppm/°C) and high decomposition temperature (500°C).
- Thermal conductivity of 0.81W/mk and V0 flammability rating.
RO3003 PCB Features:
- Ceramic-filled PTFE composite with Dk 3.0 ±0.04 and dissipation factor 0.001 at 10GHz.
- Td >500°C, thermal conductivity 0.5W/mK, and low moisture absorption (0.04%).
- CTE (x:17ppm/°C, y:16ppm/°C, z:25ppm/°C) suitable for high-temperature applications.
Typical Applications
Ideal for automotive collision avoidance systems, GPS antennas, 5G wireless infrastructure, microstrip patch antennas, satellite communications, LMDS, base station equipment, and power backplanes.
Why Choose This PCB?
Engineered with hybrid RO3210/RO3003 laminate materials, this 3-layer PCB delivers stable electrical performance across frequencies and temperatures, supported by high-plated thru-hole reliability and standard PWB processing compatibility. Its robust construction meets IPC-Class-2 standards for critical RF and automotive applications.
Tags: Rogers RO3210 PCB, RO3003 3-layer PCB, 3.0mm PCB thickness, automotive RF applications, immersion tin surface finish, 1oz copper PCB, IPC-Class-2 PCB, Gerber RS-274-X, high-frequency PCB
Order Now for Automotive & RF Applications!
Power your automotive radar, 5G infrastructure, or satellite communication projects with this Rogers hybrid PCB. Order today for reliable performance in high-frequency and high-temperature environments.
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