Rigid-Flex PCB with 1.6mm Fr-4 Stiffener

Product Details
Customization: Available
Insulation Materials: Epoxy Resin
Flame Retardant Properties: V0
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Basic Info.

Model NO.
BIC-1733-V2
Application
Wireless Security System
Wireless Security
1.6mm
Pth Cu Thickness
≥20 µm
out Copper Thick
35 Um (1oz)
Inner Copper Thick
35 Um (1oz)
Coverlay Colour
Yellow/Green Solder Mask
Surface Finish
Immersion Gold
Legend Color
White
Peeling Test of Coverlay
No Peelable
RoHS Required
Yes
Test
100% Electrical Test
Structure
Double-Sided FPC
Material
Polyimide
Combination Mode
Adhesive Flexible Plate
Conductive Adhesive
Conductive Silver Paste
Processing Technology
Electrolytic Foil
Base Material
Copper
Transport Package
Transparent Bags
Specification
91.5X 105.3mm
Trademark
8534009000
Origin
China
HS Code
8534009000
Production Capacity
25000 Pieces Per Month

Product Description

Rigid-flex PCB double sided board with 1.6mm thick FPC 384


Commodity Introduction
This is a type of rigid-flexible PCB for the application of Wireless Security System. It's a 3 layer rigid-
flex PCB at 1.6mm thick at rigid part. The base laminate is from Shengyi. It's fabricated per IPC 6012 Class 2 using supplied Gerber data.


Parameter & Data Sheet
Size of Flexible PCB 91.5X 105.3mm
Number of Layers 3
Board Type Rigid-flex PCB
Board Thickness 1.6mm
Board Material Polyimide (PI) 25µm
Board Material Supplier Shengyi
Tg Value of Board Material  60ºC
 
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes 35 µm
Surface Cu thickness 35 µm
 
Coverlay Colour Yellow / Green Solder mask
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material NO
Stiffener Thickness N/A
 
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90ºC No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25ºC±125ºC, 1000 cycles. 
Thermal Stress Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering.
Function  100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2



MCPCB Capability
Metal core PCB's are thermal management circuit boards which use a base metal material as the heat radiator part of the PCB. They are used in high heat generating application like LED lighting in the area of high power LED lighting, Automotive Interior, Exterior Lighting, Parking Garage Lighting, LED spot light etc. The metal core can be aluminum (aluminum core PCB) and copper (copper core PCB). The most common used aluminum core PCB is the thermal conductivity at 1W/MK and 2W/MK.
NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, 
OSP
4 Thickness of Surface plating HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5 Layer Count 1-4 Layers
6 Maximum of Board Size 23" x 46" (584mm×1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm×5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness 0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),
3OZ(105µm),4OZ(140µm)
10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20µm
16 Tolerance of PTH ±0.00295" (0.075mm) 
17 Tolerance of NPTH ±0.00197" (0.05mm) 
18 Deviation of Hole Position  ±0.00394" (0.10mm) 
19 Outline Tolerance Routing: ±0.00394" (0.1mm)
Punching: ±0.00591" (0.15mm) 
20 Angle of V-cut 30°, 45°, 60°
21 V-cut Size 0.1969" x 47.24" (5mm×1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle ±5º
24 V-CUT Verticality ≤0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315" 
(0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" 
(1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13µm (0.013mm)
29 Insulation Resistance 1012ΩNormal
30 Peel-off Strength 2.2N/mm
31 Solder float 260ºC 3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist ≤0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)




 

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