Rigid-flex PCB double sided board with 1.6mm thick FPC 384
Commodity Introduction
This is a type of rigid-flexible PCB for the application of Wireless Security System. It's a 3 layer rigid-
flex PCB at 1.6mm thick at rigid part. The base laminate is from Shengyi. It's fabricated per IPC 6012 Class 2 using supplied Gerber data.
Parameter & Data Sheet
Size of Flexible PCB |
91.5X 105.3mm |
Number of Layers |
3 |
Board Type |
Rigid-flex PCB |
Board Thickness |
1.6mm |
Board Material |
Polyimide (PI) 25µm |
Board Material Supplier |
Shengyi |
Tg Value of Board Material |
60ºC |
|
PTH Cu thickness |
≥20 µm |
Inner Iayer Cu thicknes |
35 µm |
Surface Cu thickness |
35 µm |
|
Coverlay Colour |
Yellow / Green Solder mask |
Number of Coverlay |
2 |
Thickness of Coverlay |
25 µm |
Stiffener Material |
NO |
Stiffener Thickness |
N/A |
|
Type of Silkscreen Ink |
IJR-4000 MW300 |
Supplier of Silkscreen |
TAIYO |
Color of Silkscreen |
White |
Number of Silkscreen |
1 |
|
Peeling test of Coverlay |
No peelable |
Legend Adhesion |
3M 90ºC No peeling after Min. 3 times test |
|
Surface Finish |
Immersion Gold |
Thickness of Nickle/Gold |
Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required |
Yes |
Famability |
94-V0 |
|
Thermal Shock Test |
Pass, -25ºC±125ºC, 1000 cycles. |
Thermal Stress |
Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
Function |
100% Pass electrical test |
Workmanship |
Compliance with IPC-A-600H & IPC-6013C Class 2 |
MCPCB Capability
Metal core PCB's are thermal management circuit boards which use a base metal material as the heat radiator part of the PCB. They are used in high heat generating application like LED lighting in the area of high power LED lighting, Automotive Interior, Exterior Lighting, Parking Garage Lighting, LED spot light etc. The metal core can be aluminum (aluminum core PCB) and copper (copper core PCB). The most common used aluminum core PCB is the thermal conductivity at 1W/MK and 2W/MK.
NO. |
Parameter |
Value |
1 |
Type of Metal Core |
Aluminum, Copper, Iron |
2 |
Model of Metal Core |
A1100, A5052, A6061, A6063, C1100 |
3 |
Surface Finish |
HASL, Immersion Gold, Immersion Silver,
OSP |
4 |
Thickness of Surface plating |
HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm |
5 |
Layer Count |
1-4 Layers |
6 |
Maximum of Board Size |
23" x 46" (584mm×1168mm) |
7 |
Mininum of Board Size |
0.1969" x 0.1969" (5mm×5mm) |
8 |
Board Thickness |
0.0157" x 0.2362" (0.4-6.0mm) |
9 |
Copper Thickness |
0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),
3OZ(105µm),4OZ(140µm) |
10 |
Minimum Track Width |
5mil (0.127mm) |
11 |
Minimum Space |
5mil (0.127mm) |
12 |
Minimum Hole Size |
0.0197" (0.5mm) |
13 |
Maximum Hole Size |
No limit |
14 |
Minimum Holes Punched |
PCB thickness <1.0mm: 0.0394" (1.0mm) |
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm) |
15 |
PTH Wall Thickness |
>20µm |
16 |
Tolerance of PTH |
±0.00295" (0.075mm) |
17 |
Tolerance of NPTH |
±0.00197" (0.05mm) |
18 |
Deviation of Hole Position |
±0.00394" (0.10mm) |
19 |
Outline Tolerance |
Routing: ±0.00394" (0.1mm) |
Punching: ±0.00591" (0.15mm) |
20 |
Angle of V-cut |
30°, 45°, 60° |
21 |
V-cut Size |
0.1969" x 47.24" (5mm×1200mm) |
22 |
Thickness of V-cut Board |
0.0236" x 0.1181" (0.6-3mm) |
23 |
Tolerance of V-cut Angle |
±5º |
24 |
V-CUT Verticality |
≤0.0059" (0.15mm) |
25 |
Minimum Square Slots Punched |
PCB thickness < 1.0mm: 0.0315" x 0.0315"
(0.8 x 0.8mm) |
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394"
(1.0 x 1.0mm) |
26 |
Minimum BGA PAD |
0.01378" (0.35mm) |
27 |
Minimum Width of Solder Mask Bridge. |
8mil (0.2032mm) |
28 |
Minimum Thickness of Solder Mask |
>13µm (0.013mm) |
29 |
Insulation Resistance |
1012ΩNormal |
30 |
Peel-off Strength |
2.2N/mm |
31 |
Solder float |
260ºC 3min |
32 |
E-test Voltage |
50-250V |
33 |
Thermal Conductivity |
0.8-8W/M.K |
34 |
Warp or Twist |
≤0.5% |
35 |
Flammability |
FV-0 |
36 |
Minimum Height of Component indicator |
0.0059"(0.15mm) |
37 |
Minimum Open Solder Mask on Pad |
0.000394" (0.01mm) |