20.7mil Rogers RO4350B LPCB Rogers Circuit Board With Ni/Au for Low Noise Amplifier
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
A unique Rogers' technology is employed in RO4350B LoPro laminates. Thanks to this technology, the reverse - treated foil can be bonded to the standard RO4350B dielectric. As a consequence, the laminate has reduced conductor loss, leading to better insertion loss and more reliable signal integrity. Meanwhile, it retains all the other beneficial features of the standard RO4350B laminate system.
Features and Benefits:
RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density
Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility
Lead-free process compatible
1. High temperature processing
2. Meets environmental concerns
CAF resistant
Our PCB Capability (RO4350B LoPro)
| Our PCB Capability (RO4350B LoPro) |
| PCB Material: |
Hydrocarbon Ceramic Laminates |
| Designation: |
RO4350B LoPro |
| Dielectric constant: |
3.48±0.05 |
| Layer count: |
Double Layer, Multilayer, Hybrid PCB |
| Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: |
10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Some Typical Applications:
- Digital applications such as servers, routers, and high speed back planes
- Cellular base station antennas and power amplifiers
- LNB's for direct broadcast satellites
- RF Identification Tags
Typical Properties of RO4350B LoPro
| Typical Properties of RO4350B LoPro |
| Property |
Typical Value |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant, Process |
3.48 ± 0.05 |
z |
-- |
10 GHz/23°C |
IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, Design |
3.55 |
z |
-- |
8 to 40 GHz |
Differential Phase Length Method |
| Dissipation Factor tan, |
0.0037 0.0031 |
z |
-- |
10 GHz/23°C 2.5 GHz/23°C |
IPC-TM-650 2.5.5.5 |
| Thermal Coeffifi cient of r |
50 |
z |
ppm/°C |
-50°C to 150°C |
IPC-TM-650 2.5.5.5 |
| Volume Resistivity |
1.2 X 1010 |
|
MΩ•cm |
COND A |
IPC-TM-650 2.5.17.1 |
| Surface Resistivity |
5.7 X 109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
| Electrical Strength |
31.2(780) |
z |
KV/mm(V/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
| Tensile Modulus |
11473(1664) |
Y |
MPa(kpsi) |
RT |
ASTM D638 |
| Tensile Strength |
175(25.4) |
Y |
MPa(kpsi) |
RT |
ASTM D638 |
| Flexural Strength |
255(37) |
|
MPa(kpsi) |
|
IPC-TM-650 2.4.4 |
| Dimensional Stability |
<0.5 |
X,Y |
mm/m(mils/inch) |
after etch +E2/150°C |
IPC-TM-650 2.4.39A |
| Coeffifi cient of Thermal Expansion |
14 |
x |
ppm/°C |
-55 to 288°C |
IPC-TM-650 2.1.41 |
| 16 |
y |
| 35 |
z |
| Tg |
>280 |
|
°C TMA |
A |
IPC-TM-650 2.4.24.3 |
| Td |
390 |
|
°C TGA |
|
ASTM D3850 |
| Thermal Conductivity |
0.62 |
|
W/m/°K |
80°C |
ASTM C518 |
| Moisture Absorption |
0.06 |
|
% |
48 hrs immersion 0.060" sample Temperature 50°C |
ASTM D570 |
| Density |
1.86 |
|
gm/cm3 |
23°C |
ASTM D792 |
| Copper Peel Strength |
0.88(5.0) |
|
N/mm(pli) |
after solder float 1 oz. TC Foil |
IPC-TM-650 2.4.8 |
| Flammability |
V-0 |
|
|
|
UL 94 |
| Lead-Free Process Compatible |
Yes |
|
|
|
|
Audited Supplier 
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