RO4003c Hybrid PCB Board for RF Electronics

Product Details
Customization: Available
Type: Flexible Circuit Board
Dielectric: Rogers RO4003c (Woven Glass-Reinforced Hydrocarbon
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  • RO4003c Hybrid PCB Board for RF Electronics
  • RO4003c Hybrid PCB Board for RF Electronics
  • RO4003c Hybrid PCB Board for RF Electronics
  • RO4003c Hybrid PCB Board for RF Electronics
  • RO4003c Hybrid PCB Board for RF Electronics
  • RO4003c Hybrid PCB Board for RF Electronics
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Basic Info.

Model NO.
BIC-1086-V3.0
Material
RO4003c Cores: 12mil (0.305mm) for Outer RF-Critic
Application
Cellular Base Station Antennas
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Enig
Base Material
RO4003c Cores: 12mil (0.305mm) for Outer RF-Critic
Insulation Materials
RO4003c+Fr-4
Brand
Rogers
Board Types
Flexible PCB
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, Pcbdoc etc
Service Area
Worldwide, Globally
Transport Package
Shipping Vacuum Packaging
Specification
76mm × 74mm (± 0.15mm, single unit)
Trademark
bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

 

This 6-layer hybrid PCB combines Rogers RO4003C and FR-4 materials, offering superior RF performance with cost-effective manufacturability. Designed for high-frequency applications, it features impedance control (50Ω), resin-filled vias, and excellent thermal stability, making it ideal for cellular base stations, automotive radar, and satellite systems.

 
 

PCB Construction Details (Summary Table)

Parameter Specification
Base Material RO4003C/High Tg FR-4 Hybrid
Layer Count 6-layer
Board Dimensions 76mm x 74mm (±0.15mm)
Minimum Trace/Space 5/7 mils
Minimum Hole Size 0.2mm
Finished Thickness 1.1mm
Copper Weight 1 oz (35 µm) outer layers
Via Plating 25 µm (resin-filled 0.2mm/0.25mm vias)
Surface Finish Immersion Gold
Silkscreen/Solder Mask White/Matt Blue
Impedance Control 50Ω (23mil top layer)
Quality Standard IPC-Class-2
 

Other Key Components & Features
Stackup:

  • Copper_layer_1 - 35 μm 
    Rogers 4003C Core - 12mil (0.305 mm)
    Copper_layer_2 - 35 μm
    Prepreg - 0.076mm (3mil)
    Copper_layer_3 - 35 μm
    Core FR-4 Tg170 -0.076mm (3mil)
    Copper_layer_4 - 35 μm
    Prepreg - 0.076mm (3mil)
    Copper_layer_5 - 35 μm 
    Rogers 4003C Core - 12mil (0.305 mm)
    Copper_layer_6 - 35 μm


  •  

Material Advantages:

  • High-Frequency Performance: Dk 3.38 ±0.05 @ 10GHz, low loss (Df 0.0027).

  • Thermal Stability: Tg >280°C, CTE matched to copper for reliable PTHs.

  • Cost-Effective: Processes like FR-4 with RF capabilities.

  • Lightweight: Moisture absorption <0.06%.

  •  

  • RO4003c Hybrid PCB Board for RF Electronics
    RO4003c Hybrid PCB Board for RF Electronics

     

  • Typical Applications:

  • Cellular base station antennas/power amplifiers.

  • Automotive radar, RF tags, satellite LNBs.

  •  

Why Choose This PCB?

  1. Hybrid Design: Optimizes RF performance (RO4003C) and cost (FR-4).

  2. High Reliability: Resin-filled vias and thermal stability for harsh environments.

  3. Impedance Control: Precision 50Ω traces for signal integrity.

  •  

Tags:HybridPCB ,RO4003C ,RFDesign ,ImpedanceControl ,5G

 

Additional Notes:

  • Gerber RS-274-X format accepted.

  • Non-UL94V0 (RO4003C is non-brominated).

  • Worldwide availability.

 
 
 
 
 
 
 
RO4003c Hybrid PCB Board for RF Electronics
RO4003c Hybrid PCB Board for RF Electronics
RO4003c Hybrid PCB Board for RF Electronics
RO4003c Hybrid PCB Board for RF Electronics
RO4003c Hybrid PCB Board for RF Electronics

 

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