High-Frequency Double-Sided RO4003c PCB - 1.6mm Thickness with HASL Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1005-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Frequency Double-Sided RO4003C PCB - 1.6mm Thickness with HASL Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Premium RF PCB Overview
Engineered for demanding wireless applications, this double-sided PCB utilizes Rogers RO4003C high-frequency laminate to deliver exceptional signal integrity and thermal performance. Designed for 5G infrastructure, automotive radar systems, and satellite communications, this 1.6mm thick board features HASL (Hot Air Solder Leveling) surface finish and complies with IPC-Class-2 quality standards for reliable operation in harsh environments.

Key Technical Advantages:
Superior Signal Transmission: Dielectric constant of 3.38±0.05 @ 10GHz with ultra-low loss (0.0027)
Thermal Efficiency: 0.71 W/m/K conductivity with CTE matched to copper (11/14 ppm/°C X/Y)
Cost-Effective Manufacturing: Processes like standard FR-4 while delivering RF performance
Robust Construction: Plated slot holes and 1 mil via plating for mechanical durability
High-Density Design: 7/6 mil trace/space capability supports complex RF layouts

2. Comprehensive Specifications

Parameter	Specification
Base Material	Rogers RO4003C
Layer Configuration	Double-Sided
Panel Dimensions	233mm x 229mm (2 types, 10-up panel)
Minimum Trace/Space	7/6 mils
Minimum Hole Size	0.3mm
Special Features	Plated slot holes
Finished Thickness	1.6mm
Copper Weight	1 oz (35µm) all layers
Via Plating	1 mil thickness
Surface Finish	HASL
Solder Mask	Green (Top), None (Bottom)
Silkscreen	White (Top), None (Bottom)
Quality Assurance	100% Electrical Tested

3. Advanced Engineering Features

Optimized Stackup Architecture
Conductive Layers: 35µm finished copper on both sides
Dielectric Core: 60mil RO4003C substrate for stable impedance
Thermal Management: CTE matched to copper for reduced stress

Manufacturing Precision
High Component Density: 95 components with 112 pads (37 thru-hole, 75 SMT)
Reliable Interconnects: 68 precision vias with 1 mil plating
Design Compatibility: PCBDOC file format support
Cost Efficiency: Standard FR-4 processing methods reduce fabrication costs

Material Superiority
Frequency Stability: ±40ppm/°C thermal coefficient of Dk (-50°C to 150°C)
Moisture Resistance: 0.06% absorption rate for reliable performance
Thermal Endurance: Tg >280°C withstands high-temperature processes

Target Applications
Telecommunications: 5G base station antennas and power amplifiers
Automotive Systems: Radar sensors and collision avoidance
Satellite Technology: Low-noise block converters (LNBs)
RF Identification: High-frequency tags and sensors

Competitive Advantages
1. RF Performance: Optimized dielectric properties for high-frequency signals
2. Mechanical Reliability: Plated slot holes enhance structural integrity
3. Cost-Effective: Processes like FR-4 with superior RF characteristics
4. Thermal Stability: Matched CTE prevents delamination and warping

Request Your Custom RF Solution
Contact our engineering team for specialized configurations or volume production quotes. Perfect for applications demanding high-frequency performance and reliability.

Thank you for your reading and you're welcome to contact us for your PCB enquiries.