Ultra-Thin RO4350b RF PCB - 0.83mm Double-Sided with Immersion Silver Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4350b
• Model NO.: BIC-1006-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Ultra-Thin RO4350B RF PCB - 0.83mm Double-Sided with Immersion Silver Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. High-Frequency PCB Overview
This precision-engineered double-sided PCB utilizes Rogers RO4350B high-performance laminate to deliver exceptional signal integrity in compact RF applications. Designed for 5G infrastructure, automotive radar, and satellite communications, this ultra-thin 0.83mm board features immersion silver surface finish and complies with IPC-Class-2 standards for reliable operation in demanding environments.

Key Performance Advantages:
Superior Signal Transmission: Dielectric constant of 3.48±0.05 @ 10GHz with low loss (0.0037)
Enhanced Thermal Management: Copper-filled vias improve heat dissipation (0.69 W/m/K)
Ultra-Compact Design: 122mm x 74mm dimensions ideal for space-constrained applications
Cost-Effective Manufacturing: Processes like standard FR-4 while delivering RF performance
Thermal Stability: CTE matched to copper (10/12 ppm/°C X/Y) with Tg >280°C

2. Technical Specifications

Parameter	Specification
Base Material	Rogers RO4350B
Layer Configuration	Double-Sided
Board Dimensions	122mm x 74mm (±0.15mm)
Minimum Trace/Space	7/9 mils
Minimum Hole Size	0.3mm
Finished Thickness	0.83mm
Copper Weight	1 oz (35µm) all layers
Via Treatment	Copper paste filled for thermal management
Surface Finish	Immersion Silver
Solder Mask	None (Top & Bottom)
Silkscreen	None (Top & Bottom)
Quality Assurance	100% Electrical Tested

3. Advanced Design Features

Optimized Stackup Configuration
Conductive Layers: 35µm finished copper on both sides
Dielectric Core: 20mil RO4350B substrate for optimal signal transmission
Thermal Vias: Copper-filled for enhanced heat dissipation

Manufacturing Excellence
Component Density: 74 components with 109 pads (46 thru-hole, 63 SMT)
Precision Interconnects: 54 thermal vias with copper paste filling
File Compatibility: Gerber RS-274-X format for seamless fabrication
Global Availability: Worldwide service for prototypes and production

Material Benefits
Dimensional Stability: CTE matched to copper prevents warping
Moisture Resistance: 0.06% absorption rate ensures reliability
Flame Retardant: UL 94 V-0 rated for high-power applications

Target Applications
5G Network Equipment: Base station antennas and power amplifiers
Automotive Radar: Collision avoidance and ADAS systems
Satellite Communications: LNB modules for broadcast systems
RFID Systems: High-frequency identification tags

Competitive Advantages
1. Ultra-Thin Profile: 0.83mm thickness for compact designs
2. Enhanced Thermal Path: Copper-filled vias improve heat dissipation
3. High-Frequency Optimized: 7/9 mil trace/space for RF layouts
4. Cost-Effective: FR-4 processing with superior RF performance

Order Your Custom RF Solution Today
Contact our engineering team for specialized configurations or production quotes. Ideal for applications requiring high-frequency performance in minimal space.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.