High-Power RF PCB: 2-Layer 0.3mm Rogers RT/duroid 6035HTC PCB with Immersion Gold
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Overview of This PCB
This specialized 2-layer RT/duroid 6035HTC PCB delivers superior performance in high-power RF/microwave applications. Built on Rogers RT/duroid 6035HTC laminate with 0.3mm thickness and 1oz copper layers, it combines exceptional thermal management (1.44 W/m/K) with high-frequency signal integrity. IPC-Class-2 certified and featuring immersion gold finish, Rogers RT/duroid 6035HTC PCB meets rigorous demands for amplifiers, filters, and combiners.
2. PCB Construction Details
| Feature |
Specification |
| Base Material |
RT/duroid 6035HTC (Ceramic-filled PTFE composite) |
| Layer Count |
2 Layers |
| Board Dimensions |
62.95mm x 107.5 mm ±0.15mm |
| Min Trace/Space |
4 mil / 4 mil (0.1016mm) |
| Min Hole Size |
0.35mm |
| Blind/Buried Vias |
None |
| Finished Thickness |
0.3mm |
| Finished Cu Weight |
1oz (35µm) - Outer Layers |
| Via Plating Thickness |
20 μm Reliable connectivity |
| Surface Finish |
Immersion Gold (ENIG) |
| Top Silkscreen |
Black |
| Bottom Silkscreen |
None |
| Top/Bottom Solder Mask |
None |
| Electrical Test |
100% Tested Prior to Shipment |
3. Additional Key Components & Features
PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
RT/duroid 6035HTC - 0.254 mm (10mil)
Copper_layer_2 - 35 μm
Design & Manufacturing Specifications
35 Components | 98 Pads (67 Thru-Hole, 31 Top SMT)
56 Vias | 4 Nets
Artwork: Gerber RS-274-X
Standard: IPC-Class-2 Compliant
Availability: Worldwide
Material Advantages:
Thermal Conductivity: 1.44 W/m/K (2.4× standard materials)
Ultra-Low Loss: Dk=3.5±0.05 / Df=0.0013 @10GHz
Stability: CTE X/Y 19 ppm/°C, Z 39 ppm/°C
Drillability: Advanced filler system vs alumina laminates
Moisture Resistance: 0.06% absorption
Typical Applications:
High-Power RF/Microwave Amplifiers
5G PAs, Combiners & Power Dividers
Aerospace Radar Systems
Satellite Communication Hardware
Why Choose This PCB?
This ultra-thin RF PCB features RT/duroid 6035HTC's exceptional high thermal conductivity in a 2-layer design with 0.3mm thickness and 4/4 mil trace precision. IPC-Class-2 certified for high-power amplifiers and microwave PCB applications, it ensures reliability in 5G, aerospace, and satellite systems.
Tags: RT/duroid 6035HTC, 2-layer PCB, 0.3mm thickness, high thermal conductivity, ultra-low loss, IPC-Class-2, RF PCB, microwave PCB, 4/4 mil trace, high-power amplifier
Order Now for High-Power RF Solutions!
Optimize thermal performance with our global-ready RT/duroid 6035HTC PCB featuring ENIG finish. Request IPC-Class-2 certified boards with Gerber RS-274-X compatibility today!
Audited Supplier 
){kind=link}