Rogers Tmm4 Microwave Printed Circuit Board 15mil 20mil 25mil 30mil 50mil 60mil with Immersion Gold

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-355-V2.1
• Material: Hydrocarbon/Ceramic
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Glass Reinforced Hydrocarbon
• Surface Finish: Bare Copper, HASL, Enig, Immersion Tin, Immersion
• Solder Mask Color: Green, Black, Blue, Yellow, Red etc
• Copper Weight: 1oz (35µm), 2oz (70µm)
• Transport Package: Vacuum
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

Rogers TMM4 Microwave Printed Circuit Board 15mil 20mil 25mil 30mil 50mil 60mil With Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Rogers TMM4 thermoset microwave material is ceramic, hydrocarbon, thermoset polymer composite designed for high plated-through-hole reliability stripline and microstrip applications. It's available with dielectric constant at 4.70. The electrical and mechanical properties of TMM4 combine many of the benefits of both ceramic and traditional PTFE microwave circuit materials, without requiring the specialized production techniques. It does not require a sodium napthanate treatment prior to electroless plating.

TMM4 has an exceptionally low thermal coefficient of dielectric constant, typically less than 30 PPM/°C. The material's isotropic coefficient of thermal expansion, very closely matched to copper, allows for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM4 is approximately twice that of traditional PTFE/ceramic materials, facilitating heat removal.
 
TMM4 is based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.  

Our PCB Capability (TMM4)

PCB Material:	Composite of Ceramic, hydrocarbon and thermoset polymer
Designator:	TMM4
Dielectric constant:	4.5  ±0.045 (process);                                                               4.7 (design)
Layer count:	Single Sided, Double Sided, Multi-layer, Hybrid designs
Copper weight:	1oz (35µm), 2oz (70µm)
Laminate thickness:	15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm), 150mil (3.810mm), 200mil (5.08mm), 250mil (6.35mm), 500mil (12.7mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, Pure gold (no nickle under gold), OSP, ENEPIG

Typical Applications
Chip testers
Dielectric polarizers and lenses
Filters and coupler
Global Positioning Systems Antennas
Patch Antennas
Power amplifiers and combiners
RF and microwave circuitry
Satellite communication systems


Data Sheet of TMM4

TMM4 Typical Value
Property		TMM4	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		4.5±0.045	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		4.7	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.002	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		+15	-	ppm/°K	-55ºC-125ºC	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		6 x 10^8	-	Mohm.cm	-	ASTM D257
Surface Resistivity		1 x 10^9	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		371	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	ºCTGA	-	ASTM D3850
Coefficient of Thermal Expansion - X		16	X	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		16	Y	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		21	Z	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.7	Z	W/m/K	80 ºC	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.7 (1.0)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		15.91	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.76	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.07	-	%	D/24/23	ASTM D570
	3.18mm (0.125")	0.18
Specific Gravity		2.07	-	-	A	ASTM D792
Specific Heat Capacity		0.83	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-