Customization: | Available |
---|---|
Type: | Rigid Circuit Board |
Dielectric: | Ceramic-Filled Laminates Reinforced with Woven Fib |
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(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Introduction
Our PCB Capability (RO3206)
PCB Capability (RO3206) | |
PCB Material: | Ceramic-filled Laminates Reinforced with Woven Fiberglass |
Designation: | RO3206 |
Dielectric constant: | 6.15 |
Dissipation factor | 0.0027 |
Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
Copper weight: | 1oz (35µm), 2oz (70µm) |
Dielectric thickness | 25mil (0.635mm), 50mil (1.27mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc.. |
Typical Applications
RO3206 PCBs are widely used in various industries, including:
1.Automotive collision avoidance systems
2.Automotive global positioning satellite antennas
3.Base station infrastructure
4.Direct broadcast satellites
5.Datalink on cable systems
6.LMDS (Local Multipoint Distribution Service) and wireless broadband
7.Microstrip patch antennas for wireless communications
8.Remote meter readers
9.Power backplanes
10.Wireless telecommunications systems
Property | RO3206 | Direction | Unit | Condtion | Test Method |
Dielectric Constant, εr Process | 6.15± 0.15 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant, εr Design | 6.6 | Z | - | 8 GHz - 40 GHz | Differential Phase Length Method |
Dissipation Factor, tan δ | 0.0027 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 |
Thermal Coefficient of εr | -212 | Z | ppm/°C | 10 GHz 0-100°C | IPC-TM-650 2.5.5.5 |
Dimensional Stability | 0.8 | X,Y | mm/m | COND A | ASTM D257 |
Volume Resistivity | 103 | MΩ•cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 103 | MΩ | COND A | IPC 2.5.17.1 | |
Tensile Modulus | 462 462 |
MD CMD |
kpsi | 23°C | ASTM D638 |
Water Absorption | <0.1 | - | % | D24/23 | IPC-TM-650 2.6.2.1 |
Specific Heat | 0.85 | J/g/K | Calculated | ||
Thermal Conductivity | 0.67 | - | W/m/K | 80°C | ASTM C518 |
Coefficient of Thermal Expansion (-55 to 288 °C) | 13 34 |
X,Y, Z |
ppm/°C | 23°C/50% RH | IPC-TM-650 2.4.41 |
Td | 500 | °C | TGA | ASTM D3850 | |
Color | Tan | ||||
Density | 2.7 | gm/cm3 | |||
Copper Peel Strength | 10.7 | pli | 1 oz. EDC After Solder Float | IPC-TM-2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead Free Process Compatible |
YES |