Rogers RO3206 High Frequency electronic PCB with 94V0

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: Ceramic-Filled Laminates Reinforced with Woven Fib
Gold Member Since 2017

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  • Rogers RO3206 High Frequency electronic PCB with 94V0
  • Rogers RO3206 High Frequency electronic PCB with 94V0
  • Rogers RO3206 High Frequency electronic PCB with 94V0
  • Rogers RO3206 High Frequency electronic PCB with 94V0
  • Rogers RO3206 High Frequency electronic PCB with 94V0
  • Rogers RO3206 High Frequency electronic PCB with 94V0
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Basic Info.

Model NO.
BIC-217-V3.0
Material
RO3206
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
HASL
Base Material
RO3206 (Ceramic-Filled Laminate)
Insulation Materials
RO3206 (Serving as The Dielectric Material)
Model
PCB
Brand
Rogers
Surface Finish
Immersion Gold, HASL, Immersion Silver, Immersion
Solder Mask
Green, Black, Blue, Yellow, Red etc.
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, Pcbdoc etc
Service Area
Worldwide, Globally
Transport Package
Express Box
Specification
400mm*500mm
Trademark
bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Introduction

 

Key Features and Benefits
The RO3206 PCB offers several key features and benefits:
1.Woven Glass Reinforcement: Enhances rigidity, simplifying handling during fabrication and assembly.

2.Uniform Electrical and Mechanical Performance: Ideal for complex multi-layer high-frequency structures, ensuring consistent performance throughout the design.

3.Low Dielectric Loss: Minimizes signal loss and distortion, enabling excellent high-frequency performance.

4.Low In-Plane Expansion Coefficient: Matched to copper, compatible with epoxy multi-layer board hybrid designs for reliable surface-mounted assemblies.

5.Excellent Dimensional Stability: Maintains consistent dimensions during manufacturing, leading to high production yields.

6.Cost-Effective Pricing: Provides economical solutions for volume manufacturing, making it a cost-efficient choice for large-scale production.

7.Surface Smoothness: Features a smooth surface for finer line etching tolerances, allowing for precise circuit design and fabrication.


 
Rogers RO3206 High Frequency electronic PCB with 94V0


Our PCB Capability (RO3206)
 

PCB Capability (RO3206) 
PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3206
Dielectric constant: 6.15
Dissipation factor 0.0027
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 25mil (0.635mm), 50mil (1.27mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..


 

Typical Applications

RO3206 PCBs are widely used in various industries, including:

 

1.Automotive collision avoidance systems
2.Automotive global positioning satellite antennas
3.Base station infrastructure
4.Direct broadcast satellites
5.Datalink on cable systems
6.LMDS (Local Multipoint Distribution Service) and wireless broadband
7.Microstrip patch antennas for wireless communications
8.Remote meter readers
9.Power backplanes
10.Wireless telecommunications systems

Rogers RO3206 High Frequency electronic PCB with 94V0

Rogers RO3206 Data Sheet
Property RO3206 Direction Unit Condtion Test Method
Dielectric Constant, εr Process 6.15± 0.15 Z - 10 GHz 23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, εr Design                      6.6 Z - 8  GHz - 40 GHz Differential Phase Length Method
Dissipation Factor, tan δ 0.0027 Z - 10 GHz 23°C IPC-TM-650 2.5.5.5
Thermal Coefficient of εr -212 Z ppm/°C 10 GHz 0-100°C IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X,Y mm/m COND A ASTM D257
Volume Resistivity 103   MΩ•cm COND A IPC 2.5.17.1
Surface Resistivity 103   MΩ COND A IPC 2.5.17.1
Tensile Modulus 462
462
MD
CMD
kpsi 23°C ASTM D638
Water Absorption <0.1 - % D24/23 IPC-TM-650
2.6.2.1
Specific Heat 0.85   J/g/K   Calculated
Thermal Conductivity 0.67 - W/m/K 80°C ASTM C518
Coefficient of Thermal Expansion (-55 to 288 °C) 13
34
X,Y,
Z
ppm/°C 23°C/50% RH IPC-TM-650 2.4.41
Td 500   °C TGA ASTM D3850
Color Tan        
Density 2.7   gm/cm3    
Copper Peel Strength 10.7   pli 1 oz. EDC After Solder Float IPC-TM-2.4.8
Flammability V-0       UL 94
Lead Free Process
Compatible
YES        
Rogers RO3206 High Frequency electronic PCB with 94V0
Rogers RO3206 High Frequency electronic PCB with 94V0
Rogers RO3206 High Frequency electronic PCB with 94V0

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