S1000-2m/R-F777 Circuit Board PCB of Shenzhen PCB with 94V0

• Customization: Available
• Type: Rigid-Flex PCB
• Dielectric: S1000-2m/R-F777
• Model NO.: BIC-1041-V2.1
• Material: S1000-2m Fr-4 + R-F777 Polyimide
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid-Flex
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Shengyi
• Surface Finish: Immersion Gold
• Layer Count: 4-Layer Rigid-Flex
• Solder Mask: Green (Top/Bottom)
• Silkscreen: White (Top/Bottom)
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 63.3mm x 72.92mm (Single Unit)
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

S1000-2M/R-F777 4-Layer Hybrid PCB with 1.6mm Thickness for Automotive & Telecom Applications(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 

1. Overview of S1000-2M/R-F777 Hybrid PCB

This advanced 4-layer hybrid PCB combines S1000-2M FR-4 rigid cores and R-F777 polyimide flexible layers, engineered for high-reliability applications in automotive electronics, computing, and telecommunications. The rigid-flex design ensures exceptional mechanical durability, with a rigid section thickness of 1.6mm and a flexible part of 0.243mm, optimized for vibration-prone environments. Featuring immersion gold surface finish and 50Ω impedance control, this board minimizes signal loss while supporting high-speed data transmission. Its UL-94 V0 flammability rating and Tg >340°C (R-F777 PCB) ensure compliance with automotive and industrial safety standards, even in extreme thermal conditions.
 

2. PCB Construction Details

Parameter	Specification
Base Material	S1000-2M FR-4 + R-F777 Polyimide
Layer Count	4-Layer Rigid-Flex
Board Thickness	1.6mm (Rigid) / 0.243mm (Flex)
Dimensions	63.3mm x 72.92mm (Single Unit)
Copper Weight	1 oz (35μm) on Outer Layers
Trace/Space Minimum	4/5 mils
Drill Hole Size	0.35mm (Mechanical)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Solder Mask	Green (Top/Bottom)
Silkscreen	White (Top/Bottom)
Impedance Control	50Ω with EMI Shielding Film
Testing	100% Electrical Test Pre-Shipment

 

3. Additional Components & Features

Stackup Structure:  4-layer rigid PCB

Copper_layer_1 - 35 μm
S1000-2M FR-4 Core Dk4.4 - 0.565 mm
PrePreg 106 Coverlay 25μm
Prepreg 1080 adhesive 25μm
Copper_layer_2 - 35 μm
Polyimide adhesiveless 75μm
Copper_Layer_3 - 35μm
Prepre 1080 adhesive 25μm
Prepreg 106 coverlay 25μm
S1000-2M FR-4 Core Dk4.4 - 0.56 mm
Copper_layer_4 - 35μm
 

Key Statistics

Components: 54 (70 Thru-Hole, 18 Top SMT)

Nets: 12

Vias: 68 (Through-Hole Only)
 

Technical Specifications

Artwork Format: Gerber RS-274-X

CTE (S1000-2M): Low Z-axis expansion for PTH reliability

R-F777 Properties: Dk=3.2 @1MHz, Peel Strength=1.51-1.83 lb/in

Moisture Resistance: 1.8% Water Absorption (R-F777)
 

Benefits

High Thermal Resilience: Operates in -55°C to +150°C ranges with no delamination.

Lead-Free Compatibility: Withstands 3X reflow cycles (S1000-2M).
EMI Mitigation: Integrated shielding film reduces interference by 20dB.
 

 

Applications

Automotive ECU and sensor modules

5G base station RF frontends

Industrial IoT edge computing devices
 

Why Choose This PCB?
This hybrid design merges FR-4's cost efficiency with polyimide's flexibility, delivering 40% higher vibration resistance than standard rigid boards. Its 50Ω impedance accuracy (±5%) and EMI shielding ensure signal integrity for high-frequency automotive and telecom systems.

Tags: S1000-2M PCB, R-F777 Polyimide, 4-Layer Rigid-Flex, 1.6mm Thickness PCB, Automotive Electronics Board, EMI Shielded Circuit.

Upgrade Your Designs with Unmatched Durability!
Ideal for harsh environments,  S1000-2M/R-F777 Hybrid PCB offers IPC-Class-2 reliability and global availability-perfect for engineers prioritizing thermal stability and signal precision. Contact us today to integrate this hybrid solution into your next automotive or telecom project!