High-Performance Double-Sided RO4350b PCB – 1.6mm Thickness, 6/6 Mil Trace/Space for RF & Microwave Applications

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4350b PCB
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  • High-Performance Double-Sided RO4350b PCB – 1.6mm Thickness, 6/6 Mil Trace/Space for RF & Microwave Applications
  • High-Performance Double-Sided RO4350b PCB – 1.6mm Thickness, 6/6 Mil Trace/Space for RF & Microwave Applications
  • High-Performance Double-Sided RO4350b PCB – 1.6mm Thickness, 6/6 Mil Trace/Space for RF & Microwave Applications
  • High-Performance Double-Sided RO4350b PCB – 1.6mm Thickness, 6/6 Mil Trace/Space for RF & Microwave Applications
  • High-Performance Double-Sided RO4350b PCB – 1.6mm Thickness, 6/6 Mil Trace/Space for RF & Microwave Applications
  • High-Performance Double-Sided RO4350b PCB – 1.6mm Thickness, 6/6 Mil Trace/Space for RF & Microwave Applications
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Basic Info.

Model NO.
BIC-1001-V1.0
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Aluminum
Insulation Materials
Hydrocarbon Resin
Model
PCB
Brand
Taconic
Tihickness
8mil, 10mil, 12mil, 20mil, 32mil and 60mil
Soldermask Color
Blcak, Blue, Yellow, Red, Green...
Copper Weight
0.5oz, 1oz, 2oz
Transport Package
Packing
Specification
≤ 400mm X 500mm
Trademark
Bicheng
Origin
China
HS Code
8534009000
Production Capacity
10000PCS/Year

Packaging & Delivery

Package Size
50.00cm * 30.00cm * 30.00cm
Package Gross Weight
2.000kg

Product Description

High-Performance Double-Sided RO4350B PCB - 1.6mm Thickness, 6/6 mil Trace/Space for RF & Microwave Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of This PCB
Engineered for cutting-edge RF and microwave systems, this double-sided PCB leverages Rogers RO4350B laminate to deliver superior electrical performance, thermal management, and cost efficiency. Optimized for 5G infrastructure, automotive radar, satellite communications, and IoT devices, it combines the low-loss benefits of PTFE materials with the manufacturability of standard FR-4 processes. Certified to IPC-Class-2 standards and UL 94 V-0 flammability rated, this PCB guarantees reliability in high-power and extreme environments.

Key Advantages:
Ultra-Low Signal Loss: Dielectric constant (3.48 ±0.05 @ 10GHz) and dissipation factor (0.0037 @ 10GHz) ensure precision in high-frequency applications.
Exceptional Thermal Stability: Operating range of -40°C to +85°C with a glass transition temperature (Tg >280°C) for harsh environments.
Cost-Effective Production: Compatible with standard epoxy/glass PCB manufacturing, reducing costs compared to PTFE-based alternatives.
Global Availability: Ready for prototyping and mass production worldwide.

2. PCB Construction Details (Summary Table)
Parameter Specification
Base Material RO4350B (Rogers)
Layer Count Double-Sided
Board Dimensions 76.00mm x 76.00mm (±0.15mm)
Minimum Trace/Space 6/6 mils
Minimum Hole Size 0.45mm
Blind/Buried Vias No
Finished Thickness 1.6mm
Copper Weight 1 oz (1.4 mils) all layers
Via Plating Thickness 1 mil
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Silkscreen None (Top & Bottom)
Solder Mask None (Top & Bottom)
Electrical Test 100% tested
Impedance Control No (±10% tolerance not required)


3. Other Key Components & Features
Stackup Structure
Top & Bottom Layers: 17µm base copper + 17µm plating for optimal conductivity.
Dielectric Core: 60mil RO4350B substrate ensures stable impedance and thermal dissipation (0.69 W/m/°K).

Design & Manufacturing Specifications
Component Support: 50 components, 73 pads (26 thru-hole, 47 top SMT), 71 vias, and 9 nets.
Artwork Compatibility: Accepts Gerber RS-274-X files for seamless fabrication.
Quality Compliance: IPC-Class-2 certified for commercial-grade reliability.

Material Advantages
Low CTE: Thermal expansion coefficients (X/Y/Z: 10/12/32 ppm/°C) minimize mechanical stress.
Flame Resistance: UL 94 V-0 rated for high-power RF applications.
Optimized RF Layout: No solder mask or silkscreen reduces parasitic effects, ideal for dense RF circuits.


Typical Applications
Telecom Infrastructure: 5G base station antennas, power amplifiers.
Automotive Electronics: Radar, LiDAR, and ADAS sensors.
Satellite Systems: LNB modules for direct broadcast satellites.
Industrial IoT: RFID tags, high-frequency sensors.
High-Performance Double-Sided RO4350b PCB – 1.6mm Thickness, 6/6 Mil Trace/Space for RF & Microwave Applications

Why Choose This PCB?
1. High-Frequency Precision: ENIG finish ensures reliable solderability, while 6/6 mil trace/space supports fine-pitch designs.
2. Robust Construction: 1.6mm thickness and RO4350B core provide mechanical stability.
3. Scalable Production: Streamlined design and global availability enable high-volume manufacturing.


Order Now for Reliable High-Frequency Performance!
Contact us to customize your design or request a quote for fast global delivery. Ideal for engineers prioritizing signal integrity in RF and microwave systems.
High-Performance Double-Sided RO4350b PCB – 1.6mm Thickness, 6/6 Mil Trace/Space for RF & Microwave ApplicationsThank you for your reading and you're welcome to contact us for your PCB enquiries.

 

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