RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1143-V2.1
• Material: RO4003c / It-180A Fr-4
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Immersion Gold
• Layer Count: 6 Layers
• Solder Mask: Matt Blue (Top/Bottom)
• Silkscreen: White (Top/Bottom)
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 57mm × 57mm (± 0.15mm)
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

6-Layer Rogers RO4003C and FR-4 Hybrid PCB: 1.1mm Thickness, 90Ω Impedance Control
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of This High-Frequency PCB
Engineered for demanding RF applications, this 6-layer rigid PCB combines Rogers RO4003C and IT-180A FR-4 materials. Featuring 1.1mm thickness, 4/5 mil trace precision, ENIG finish, and 90Ω impedance control,Rogers RO4003C and FR-4 PCB delivers superior signal integrity in compact designs (57×57mm ±0.15mm). Ideal for microwave systems, it includes 100% electrical testing and matt blue solder masks.

 

 

2. PCB Construction Details 

Parameter	Details
Base Material	RO4003C / IT-180A FR-4 (Tg >175°C)
Layer Count	6 layers
Board Thickness	1.1mm
Dimensions	57mm × 57mm (±0.15mm)
Min Trace/Space	4/5 mils
Min Hole Size	0.3mm (filled/capped vias)
Cu Weight (per layer)	1oz (35μm)
Surface Finish	Immersion Gold (ENIG)
Solder Mask	Matt Blue (Top/Bottom)
Silkscreen	White (Top/Bottom)
Impedance Control	90Ω single-end (Top layer)

3. Key Components, Material Advantages & Applications

Layer Stackup Architecture:
» Layer 1: Copper (35μm)
» Core: RO4003C (0.305mm)
» Layer 2: Copper (35μm)
» Prepreg (0.1mm)
» Layer 3: Copper (35μm)
» Core: IT-180A FR-4
» Layer 4: Copper (35μm)
» Prepreg (0.1mm)
» Layer 5: Copper (35μm)
» Core: RO4003C (0.305mm)
» Layer 6: Copper (35μm)
 

1. Material Advantages:
   RO4003C: Ultra-low loss (Dk=3.38 @10GHz, Df=0.0027), high Tg (>280°C), cost-effective RF performance.
   
   IT-180A FR-4: CAF-resistant, lead-free compatible, high thermal reliability (T288>20min).
    

Additional Features:
Gerber RS-274-X files, IPC-Class 2 standard.

28 components, 68 pads (32 thru-hole + 36 SMT), 73 vias.

Global shipping.


Typical Applications:
Cellular base stations, automotive radar, satellite LNBs, RFID tags, RF power amplifiers.

 

Why Choose This PCB?
This hybrid stackup leverages RO4003C's microwave performance for critical RF layers and FR-4's cost efficiency for inner cores. With ENIG corrosion resistance, 25μm via plating, and 100% electrical testing, Rogers RO4003C and FR-4 PCB ensures reliability in extreme environments while avoiding PTFE laminate costs.

Tags: 6-layer PCB, RO4003C FR-4 hybrid, 1.1mm PCB thickness, RF circuit board, impedance control PCB, Rogers 4003C laminate, ENIG finish PCB, microwave PCB, automotive radar board.

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