RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4003c
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  • RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board
  • RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board
  • RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board
  • RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board
  • RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board
  • RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board
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Basic Info.

Model NO.
BIC-1143-V2.1
Material
RO4003c / It-180A Fr-4
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Rogers
Surface Finish
Immersion Gold
Layer Count
6 Layers
Solder Mask
Matt Blue (Top/Bottom)
Silkscreen
White (Top/Bottom)
Transport Package
Kk Paper, 3-Layer Wrinkle
Specification
57mm × 57mm (± 0.15mm)
Trademark
Bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

6-Layer Rogers RO4003C and FR-4 Hybrid PCB: 1.1mm Thickness, 90Ω Impedance Control
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of This High-Frequency PCB
Engineered for demanding RF applications, this 6-layer rigid PCB combines Rogers RO4003C and IT-180A FR-4 materials. Featuring 1.1mm thickness, 4/5 mil trace precision, ENIG finish, and 90Ω impedance control,Rogers RO4003C and FR-4 PCB delivers superior signal integrity in compact designs (57×57mm ±0.15mm). Ideal for microwave systems, it includes 100% electrical testing and matt blue solder masks.

 
RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board
RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board
 

2. PCB Construction Details 

Parameter Details
Base Material RO4003C / IT-180A FR-4 (Tg >175°C)
Layer Count 6 layers
Board Thickness 1.1mm
Dimensions 57mm × 57mm (±0.15mm)
Min Trace/Space 4/5 mils
Min Hole Size 0.3mm (filled/capped vias)
Cu Weight (per layer) 1oz (35μm)
Surface Finish Immersion Gold (ENIG)
Solder Mask Matt Blue (Top/Bottom)
Silkscreen White (Top/Bottom)
Impedance Control 90Ω single-end (Top layer)

3. Key Components, Material Advantages & Applications

Layer Stackup Architecture:
» Layer 1: Copper (35μm)
» Core: RO4003C (0.305mm)
» Layer 2: Copper (35μm)
» Prepreg (0.1mm)
» Layer 3: Copper (35μm)
» Core: IT-180A FR-4
» Layer 4: Copper (35μm)
» Prepreg (0.1mm)
» Layer 5: Copper (35μm)
» Core: RO4003C (0.305mm)
» Layer 6: Copper (35μm)
 
  1. Material Advantages:
    RO4003C: Ultra-low loss (Dk=3.38 @10GHz, Df=0.0027), high Tg (>280°C), cost-effective RF performance.

    IT-180A FR-4: CAF-resistant, lead-free compatible, high thermal reliability (T288>20min).
     
RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board


Additional Features:
Gerber RS-274-X files, IPC-Class 2 standard.

28 components, 68 pads (32 thru-hole + 36 SMT), 73 vias.

Global shipping.


Typical Applications:
Cellular base stations, automotive radar, satellite LNBs, RFID tags, RF power amplifiers.

 
RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board
RO4003c and Tg170 Fr-4 Multilayer PCB Circuit of Shenzhen Power Amplifier Board


Why Choose This PCB?
This hybrid stackup leverages RO4003C's microwave performance for critical RF layers and FR-4's cost efficiency for inner cores. With ENIG corrosion resistance, 25μm via plating, and 100% electrical testing, Rogers RO4003C and FR-4 PCB ensures reliability in extreme environments while avoiding PTFE laminate costs.

Tags: 6-layer PCB, RO4003C FR-4 hybrid, 1.1mm PCB thickness, RF circuit board, impedance control PCB, Rogers 4003C laminate, ENIG finish PCB, microwave PCB, automotive radar board.

Order Now for Next-Gen RF Systems!
Deploy high-frequency solutions faster with our certified 6-layer hybrid PCBs. Request instant quotes for radar, satellite, or 5G projects-worldwide delivery guaranteed!
 


 

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