Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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Item | Requirement | Result | |
Laminate | Type | FR-4 Tg170 | FR-4 Tg170 |
Supplier | ITEQ | ITEQ | |
Board thickness | 2.4+-10%mm | 2.38-2.42mm | |
Outer copper foil | >=70 um | 73.7 um | |
Inner copper foil | 2/2 OZ | 2/2 OZ | |
Warp-twist | <= 0.75% | 0.03% | |
Legend | Type | KUANG SHUN | KUANG SHUN |
Color | White | White | |
Location | CS | CS | |
Marking | Co.logo | YES | YES |
UL.logo | YES | YES | |
Date code | WWYY | WWYY | |
Marking form | N/A | OK | |
Location | CS | CS | |
Min line width (mil) | 5.4 | 5.2 | |
Min line spacing (mil) | 6 | 6.2 | |
Min ring width (mil) | NA | NA | |
Solder Mask | Type | R-500 BL | R-500 BL |
Color | Blue | Blue | |
Thickness | >=10 um | 14 um | |
Pencil Test | 6H OR ABOVE | OK | |
SOLVENT TEST | NO ATTACK | OK | |
TAPE TEST | NO PEEL OFF | OK | |
Surface treament | ENIG | OK | |
Special Treament | Silk screen | / | / |
Location | / | / | |
Forming | V-cut | OK | |
Normal Testing | Electrical test | 100% PCB passed | OK |
Visual inspection | IPC-A-600H&IPC-6012C | OK | |
Solderability Test | 245ºC 5S 1 Cycle | OK |
Property | Thickness <0.50 mm |
Thickness >=0.50 mm |
Units | Test Method |
||
[0.0197 in] | [0.0197 in] | |||||
Typical Value |
Spec | Typical Value |
Spec | Metric | IPC-TM -650 |
|
(English) | (or as noted) |
|||||
Peel Strength, minimum |
N/mm | 2.4.8 | ||||
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] |
(lb/inch) | 2.4.8.2 | ||||
B. Standard profile copper foil |
0.96 (5.5) |
0.70 (4.0) |
0.96 (5.5) |
0.70 (4.0) |
2.4.8.3 | |
1. After Thermal Stress |
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2. At 125°C [257 F] |
||||||
3. After Process Solutions |
1.75 (10 ) |
0.80 (4.57) |
1.93 (11.0) |
1.05 (6.00) |
||
1.66 (9.5) |
0.70 (4.00) |
1.66 (9.5) |
0.70 (4.00) |
|||
1.49 (8.5) |
0.55 (3.14) |
1.49 (8.5) |
0.80 (4.57) |
|||
Volume Resistivity, minimum |
MW-cm | 2.5.17.1 | ||||
A. C-96/35/90 | 5x1010 | 106 | -- | -- | ||
B. After moisture resistance |
-- | -- | 5x1010 | 104 | ||
C. At elevated temperature E-24/125 |
5x1010 | 103 | 5x1010 | 103 | ||
Surface Resistivity, minimum |
MW | 2.5.17.1 | ||||
A. C-96/35/90 | 3.5x1010 | 104 | -- | -- | ||
B. After moisture resistance |
-- | -- | 3.5x1010 | 104 | ||
C. At elevated temperature E-24/125 |
6x1010 | 103 | 6x1010 | 103 | ||
Moisture Absorption, maximum |
0.3 | -- | 0.1 | 0.8 | % | 2.6.2.1 |
Dielectric Breakdown, minimum |
-- | -- | 60 | 40 | kV | 2.5.6 |
Permittivity (Dk, 50% resin content) |
4.6 | 5.4 | 4.6 | 5.4 | -- | 2.5.5.9 |
(Laminate & Laminated Prepreg) |
||||||
A. 1MHz | ||||||
Loss Tangent (Df, 50% resin content) |
0.016 | 0.035 | 0.016 | 0.035 | -- | 2.5.5.9 |
(Laminate & Laminated Prepreg) |
||||||
A. 1MHz | ||||||
Flexural Strength, minimum |
N/mm2 | 2.4.4 | ||||
A. Length direction | -- | -- | 500-530 | 415 | (lb/in2) | |
-- | -- | (72,500-76,850) | -60,190 | |||
B. Cross direction | -- | -- | 430-460 | 345 | ||
-- | -- | (62,350-66,700) | -50,140 | |||
Arc Resistance, minimum |
120 | 60 | 120 | 60 | s | 2.5.1 |
Thermal Stress 10 s at 288°C [550.4F],minimum |
Rating | 2.4.13.1 | ||||
A. Unetched | Pass | Pass Visual |
Pass | Pass Visual |
||
B. Etched | Pass | Pass Visual |
Pass | Pass Visual |
||
Electric Strength, minimum |
45 | 30 | -- | -- | kV/mm | 2.5.6.2 |
(Laminate & Laminated Prepreg) |
||||||
Flammability, | V-0 | V-0 | V-0 | V-0 | Rating | UL94 |
(Laminate & Laminated Prepreg) |
||||||
Glass Transition Temperature (DSC) |
140 | 135 minimum |
140 | 135 minimum |
˚C | 2.4.25 |
Decomposition Temperature |
-- | -- | 305 | -- | ˚C | 2.4.24.6 |
(5% wt loss) |
||||||
Z-Axis CTE | 2.4.24 | |||||
A. Alpha 1 | -- | -- | 55 | -- | ppm/˚C | |
B. Alpha 2 | -- | -- | 290 | -- | ppm/˚C | |
C. 50 to 260 Degrees C |
-- | -- | 4.2 | -- | % | |
Thermal Resistance | 2.4.24.1 | |||||
A. T260 | -- | -- | 15 | -- | Minutes | |
B. T288 | -- | -- | 2 | -- | Minutes | |
CAF Resistance | -- | -- | Pass | AABUS | Pass/Fail | 2.6.25 |