Lead Free PCB on 0.8mm Fr-4 Double Sided PCB Circuits

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0323-V3.23
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Final Foil External: 35 Um (1 Oz)
• Final Height of PCB: 0.8mm +/-0.08
• Surface Finish: HASL Lead Free
• Solder Mask Color: Green
• Colour of Component Legend: White
• Mininum Trace (Mil): 4 Mil
• Minimum Gap(Mil): 4 Mil
• Via: Via Tented.
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 110 x 60mm=1UP
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 2 layer printed circuit board (PCB) built on FR-4 Tg135 substrate
for the application of Embedded Systems. It's 0.8 mm thick with white silkscreen
on green solder mask and HASL (lead free) on pads. The base material is from
ITEQ supplying 1 up single board. They're fabricated per IPC 6012 Class 2 using
supplied Gerber data. Each 50 boards are packed for shipment. 

1.2 Features and benifits    
    
A. It's Lead free compatible.
B. Excellent wetting during component soldering and it can avoid copper corrosion.
C. Strict WIP inspection and monitoring as well as working instruction
D. Products and Manufacturing are certified by authorized organizations.
E. Small quantity order is accepted
F. Free stencil shim sent for new user

1.3 Application
    
AC DC,Modem WiFi, USB Wireless, Wireless Broadband, Satellite Tracking, Embedded
Programming, Embedded Operating System, IR Control, 3G Routers, High Speed Servers

1.4 Parameter and data sheet

Number of Layers	2
Board Size	110 x 60mm=1UP
Board Type	Double Sided PCB
Board Thickness	0.8mm +/-0.08
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	TG135ºC
PTH Cu thickness	≥20 um
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	35 um (1oz)
Solder Mask Type and Model No.	LPSM, PSR-2000GT600D
Solder Mask Supplier	TAIYO
Solder Mask Colour	Green
Number of Solder Masks	2
Thickness of Solder Mask	13um
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	1
Mininum Trace (mil)	4 mil
Minimum Gap(mil)	4 mil
Surface Finish	HASL Lead free
RoHS Required	Yes
Warpage	0.18%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)	T1: 0.305
	T2: 0.990
	T3: 1.092
	T4: 1.498
	T5: 2.311
	T6: 4.500