Taconic Circuit Board PCB of Shenzhen PCB Manufacturing

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Cer-10
• Model NO.: BIC-1142-V2.1
• Material: Complex
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Taconic
• Surface Finish: Immersion Tin
• Board Thickness: 1.65mm (Finished)
• Layer Count: 2-Layer
• Solder Mask: None (Top Only)
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 73.2mm x 36.44mm (± 0.15mm)
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

2-Layer CER-10 PCB: 1.65mm Thickness, Immersion Tin Finish for RF & Power Amplifiers

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of High-Frequency CER-10 PCB
This precision 2-layer rigid PCB utilizes Taconic CER-10 organic-ceramic PCB (DK-10) for demanding RF applications. Engineered with woven glass reinforcement and optimized for stable electrical properties, it features a 1.65mm thickness, immersion tin surface finish, and 1oz copper layers. Designed for power amplifiers and millimeter-wave circuits, Taconic CER-10 PCB's ultra-low Z-axis CTE (46 ppm/°C) ensures reliability in extreme thermal environments. Compliant with IPC-Class-2 standards and 100% electrically tested, CER-10 laminate supports 16 vias and 28 pads across compact 73.2mm x 36.44mm boards (2 designs per panel).
 

 

2. PCB Construction Details 

Parameter	Specification
Base Material	CER-10 Organic-Ceramic Laminate
Layer Count	2 Layers
Board Dimensions	73.2mm x 36.44mm (±0.15mm) (2 Designs/Panel)
Finished Thickness	1.65mm
Min. Trace/Space	5/5 mils
Min. Hole Size	0.4mm
Blind Vias	None
Copper Weight	1oz (35μm) Outer Layers
Via Plating	20μm
Surface Finish	Immersion Tin
Top Silkscreen	Black
Solder Mask	None (Top/Bottom)
Electrical Test	100% Pre-Shipment

 

3. Additional Components, Features & Applications

PCB Stackup Structure

Layer	Material & Thickness
Top Layer	Copper - 35μm
Core	CER-10 - 1.575mm (62mil)
Bottom Layer	Copper - 35μm

Board Statistics
14 components with 28 total pads (17 thru-hole, 11 top SMT)
16 vias across 2 nets

Material Features
Dielectric Constant: 10.0 @ 10GHz
Dissipation Factor: 0.0035 @ 10GHz
Thermal Conductivity: 0.63 W/mk
CTE Stability: X/Y/Z: 13/15/46 ppm/°C (copper-matched)
Moisture Absorption: 0.02%
Dielectric Strength: 44 kV

Key Benefits
Exceptional Bond Strength: Resists delamination during soldering
Dimensional Precision: ±0.15mm tolerance with copper-matched CTE
Low Moisture Sensitivity: 0.02% absorption for humid environments
 Frequency Stability: Consistent Dk across RF bands
 Enhanced Flexural Strength: Woven glass reinforcement

 

Typical Applications
RF Power Amplifiers: Cellular/WiFi infrastructure
Microwave Filters & Couplers: 5G/radar systems
Passive Components: Resonators, baluns
Aerospace Electronics: Avionics communication
 

Global Availability:
Manufactured and shipped worldwide with IPC-Class-2 quality assurance.

Why Choose This PCB?
CER-10's ceramic-PTFE hybrid technology delivers unmatched PTH reliability in thermal cycling (Z-CTE 46 ppm/°C) and circuit miniaturization via 5/5 mil trace/space. Ideal for >10GHz designs, its stable Dk (±0.02) and IPC-Class-2 compliance ensure signal integrity in mission-critical RF systems.

Tags: 2-Layer CER-10 PCB, 1.65mm Thickness, Immersion Tin Finish, RF Amplifier Board, DK-10 Laminate
Order Now for RF Amplifiers & 5G Solutions!

Elevate your high-frequency designs with Taconic CER-10 PCBs - optimized for millimeter-wave performance. Request a Quote or Ask for Samples today for globally shipped, electrically validated boards!