4 Layer PCB Built on 2.0mm Fr-4 with CNC Routing

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-813-V8.13
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Board Thick
2.0 mm ±10%
Surface Finish
Immersion Gold
out Layer Copper
1 Oz
Final Foil Internal
1 Oz
Solder Mask Color
Green
Silkscreen Color
White
Minimum Trace and Space
7.8 Mil / 6.2 Mil
Minimum / Maximum Holes
0.8mm / 3.2 mm
Via
Minimum Size 0.8mm.
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
172*291mm=2PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000 PCS/ Month

Product Description

1.1 General description

This is a type of multilayer PCB built on FR-4 substrate with Tg 135°C for the application of
Wireless Intercom. It's 2.0 mm thick with 4 layer copper track, white silkscreen over green solder
mask and immersion gold are on pads. The base material is used from ITEQ IT-158, entire board
supplying 2 PCBs per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data.
Each 25 panels are packed for shipment.  

1.2 Features and benifits 
   
A. Outstanding thermal resistance and suitable for lead-free process;
B. Excellent surface planarity for CSP mounted components to reduce failure rate during assembly
    and soldering;
C. Shortened connection between electronic components;
D. Quick CADCAM checking and free PCB quotation;
E. International approvals;
F.  RoHS materials;
G. Eligible products rate of first production: >95%  
H. Prototype PCB capability;
I.  Volume Production capability;
J. Quick turn-around samples;

1.3 Application

Sound System, Analog Devices, Outdoor Led Lighting, Wireless Adapter For Desktop, PC Board,
24 Volt Inverter, GPRS Module, Router WiFi USB, Security Access Control Systems, Camera
systems

1.4 Parameter and data sheet
PCB SIZE 172 x 291mm=2PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
Prepreg 7628 0.195mm
copper ------- 35um(1oz) MidLayer 1
FR-4 1.47 mm
copper ------- 35um(1oz) MidLayer 2
Prepreg 7628 0.195mm
copper ------- 18um(0.5oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 7 mil / 7 mil
Minimum / Maximum Holes: 0.8mm / 3.5 mm
Number of Different Holes: 8
Number of Drill Holes: 1432
Number of Milled Slots: 0
Number of Internal Cutouts: 12
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  FR-4 Tg135ºC, er<5.4.IT-180,  ITEQ Supplied
Final foil external:  1 oz
Final foil internal:  1 oz
Final height of PCB:  2.0 mm ±10%
PLATING AND COATING  
Surface Finish Immersion gold (31.1% ) 0.05µm over 3µm nickel
Solder Mask Apply To:  TOP and Bottom, 13 micron Minimum
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, stamp holes.
MARKING  
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:  Marked on the board in a conductor and 
leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.8mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


 

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