Untrathin PCB on 4 Layer Copper at 0.4mm Thick with Immersion Gold

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC=0350-V3.50
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Surface Cu Thickness: 35 Um (1 Oz)
• Inner Iayer Cu Thicknes: 17 Um (0.5 Oz)
• Final Height of PCB: 0.4mm +/-0.04
• Surface Finish: Immersion Gold
• Solder Mask Color: Green
• Colour of Component Legend: White
• Mininum Trace (Mil): 4 Mil
• Minimum Gap(Mil): 4 Mil
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 181 x 121mm=8UP
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 4 layer PCB board built on FR-4 Tg135 substrate for the application
of Data Acquisition Systems. It's 0.4 mm thick with white silkscreen on green solder
mask and immersion gold on pads. The base material is from ITEQ supplying 8 up
boards per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber
data. Each 50 panels are packed for shipment. 

1.2 Features and benifits    
    
A. It's suitable for handheld and consumer applications.
B.  Good oxidation resistance and good heat dissipation.
C. Comprehensive equipment management and maintenance and process control
D. UL, ISO14001, TS16949 certified
E. Money-saving, Worry-saving and Labor-saving
F. No MOQ, low cost for prototypes and small runs quantity. 

1.3 Application
    
Outdoor Lighting, GPS Navigator, WiFi Access Point, Access Control System,
Wavecom, Wireless Printer Adapter, Antenna Wireless, HMI PLC, ACess Control,
Vending mAChines

1.4 Parameter and data sheet

Number of Layers	4
Board Type	Multilayer PCB
Board Size	181 x 121mm=8UP
Board Thickness	0.4mm +/-0.04
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	135ºC
PTH Cu thickness	≥20 um (See hole wall details)
Inner Iayer Cu thicknes	17 um (0.5 oz)
Surface Cu thickness	35 um (1oz)
Solder Mask Type and Model No.	LPSM, PSR-2000GT600D
Solder Mask Supplier	TAIYO
Solder Mask Colour	Green
Number of Solder Masks	2
Thickness of Solder Mask	13um
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	2
Mininum Trace (mil)	4 mil
Minimum Gap(mil)	4 mil
Surface Finish	Immersion gold
RoHS Required	Yes
Warpage	0.18%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)	T1: 0.600
	T2: 0.890
	T3: 1.025
	T4: 1.125
	T5: 3.500

PCB high speed multihead drilling machine