RF-35tc 2-Layer 0.6mm Enig PCB with Green Solder Mask - High-Performance RF Circuit Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RF-35tc
• Model NO.: BIC-1131-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RF-35TC 2-Layer 0.6mm ENIG PCB with Green Solder Mask - High-Performance RF Circuit Board
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


Premium High-Frequency PCB Solution
Engineered for demanding RF applications, this double-sided RF-35TC circuit board delivers exceptional performance in high-power wireless systems. Utilizing Taconic's advanced ceramic-filled PTFE composite, this substrate combines industry-leading thermal management with outstanding signal integrity, making it ideal for critical RF components where every decibel matters.


Key Technical Specifications

Parameter	Specification
Core Material	RF-35TC PTFE Composite
Board Configuration	Dual-Layer Design
Overall Thickness	0.6mm Precision
Conductive Layers	1oz Electro-Deposited Copper
Circuit Geometry	4/4 mils Trace/Space Resolution
Minimum Aperture	0.25mm Mechanical Drills
Surface Treatment	Electroless Nickel Immersion Gold
Protective Coating	Green Solder Mask (Top Side Only)
Legend Printing	White Silkscreen (Top Side)
Interconnect Quality	20µm Via Wall Plating
Dielectric Properties	3.5±0.05 Dk @ 10GHz

Advanced Material Characteristics
Superior Thermal Performance
The RF-35TC substrate boasts an impressive 0.92 W/m/K thermal conductivity (with 1oz copper), effectively dissipating heat from active components and transmission lines. This thermal management capability prevents performance degradation in high-power applications.

Electrical Excellence
Ultra-Low Loss: 0.002 dissipation factor at 10GHz minimizes signal attenuation

Stable Permittivity: ±0.05 Dk tolerance ensures consistent impedance control

Broadband Performance: Maintains electrical stability across wide frequency ranges


Mechanical Reliability
Minimal Expansion: CTE of 11/13/34 ppm/°C (X/Y/Z) enhances dimensional stability

Moisture Resistance: 0.05% absorption rate guarantees performance in humid conditions

High-Temperature Endurance: 436°C decomposition temperature



Design and Manufacturing Features

Layer Structure
Top Conductor: 35µm copper with ENIG finish

Dielectric Core: 0.508mm RF-35TC substrate

Bottom Conductor: 35µm copper


Production-Ready Design
Supports 28 components (62 through-hole, 29 SMD)

Accommodates 91 connection points with 62 interlayer vias

Optimized for 3 independent circuits

Compatible with standard Gerber RS-274-X fabrication files

Meets IPC-Class-2 reliability standards


Target Applications
Wireless Infrastructure
5G Base Station Components
Microwave Backhaul Systems
Small Cell Antennas
Aerospace & Defense
Satellite Communication Modules
Radar System Components
Electronic Warfare Equipment
Commercial RF Systems
High-Power Amplifiers
Precision Filters & Couplers
RF Front-End Modules


Competitive Advantages

For RF Designers
Enhanced Signal Fidelity: Ultra-low loss tangent preserves signal integrity

Thermal Optimization: Efficient heat dissipation from active components

Stable Performance: Consistent electrical properties across temperature variations


For Procurement
Global Availability: Worldwide manufacturing and delivery network

Cost Efficiency: Superior performance-to-price ratio

Quick Turnaround: Rapid prototyping and volume production


For Manufacturing
Process Compatibility: Standard PCB fabrication techniques

Reliable Yield: Excellent material consistency

Quality Assurance: 100% electrical testing pre-shipment


Ordering Information: RF-35TC PCB, Dual-Layer ENIG Board, 0.6mm Thin RF Substrate, High-Thermal-Conductivity Circuit
Contact our technical team today for custom design support and volume production quotes. Experience the difference of true high-performance RF substrates in your next wireless design.




Thank you for your reading and you're welcome to contact us for your PCB enquiries.