PCB Printed Circuit Boards 2 Layers with Black Mask

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-426.11288-V2.3
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Solder Mask Color
Black
Legend Color
No Required
Surface Finish
Immersion Gold
Board Thick
1.6mm
Copper Thick
1 Oz
Mininum Trace (Mil)
7.7 Mil
Minimum Gap(Mil)
6.2 Mil
Thickness of Solder Mask
14 Um
RoHS Required
Yes
Test
100% Electrical Test
Transport Package
Vacuum
Specification
269.70 x227.33mm = 21up
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000PCS/Month

Product Description

PCB Printed Circuit Boards 2 Layers With Black Mask no silkscreen required                 


Commodity Introduction
This is a type of 2 layer Double sided PCB board at 1.6mm thick for the application of Isolation
Transformer. The base laminate is from ITEQ Tg135 FR-4, Black solder mask from KUANGSHUN
and no silkscreen on board. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each
20 panel boards are packed separately. 


Parameter & Data Sheet
Number of Layers 2
Board Type Double Sided PCB
Board Thickness 1.60 mm +/-0.1
Board Material FR-4
Board Material Supplier ITEQ
Tg Value of Board Material  135ºC
 
PTH Cu thickness ≥20 um (See hole wall details)
Inner Iayer Cu thicknes N/A
Surface Cu thickness 35 um (1oz)
 
Solder Mask Type and Model No. LPSM, KSM-6189BK31
Solder Mask Supplier KUANG SHUN
Solder Mask Colour Black
Number of Solder Masks 2
Thickness of Solder Mask 14um
 
Type of Silkscreen Ink NA
Supplier of Silkscreen NA
Color of Silkscreen NA
Number of Silkscreen NA
 
Mininum Trace (mil) 7.7 mil
Minimum Gap(mil) 6.2 mil
 
Surface Finish Immersion Gold
RoHS Required Yes
Warpage  0.25%
 
Thermal Shock Test Pass, 288±5ºC,10 seconds, 3 cycles. 
No delamination, no blistering.
Solderablity Test Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function  100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2

                                                            
Microsection Hole Wall (um)
Hole Wall Cu Thickness ≥20 um  Hole Wall Cu Roughness ≤25.4 um
NO. A B C E AVE
1 26.946  25.746  25.806  27.446  26.726  26.356  26.504 
2 25.555  24.355  24.415  26.055  25.335  24.965  25.113 
3 26.367  25.167  25.227  26.867  26.147  25.777  25.925 

Outline dimension Unit: mm
NO. Required Dimension (toerance) Actual dimension
1 269.70  ±0.15 269.62  269.67  269.70  269.78 
2 227.33  ±0.15 227.43  227.43  227.24  227.42 

Hole Size and Slot Dimension (mm)
NO. Requerment Dimension (tolerance) PTH/NPT Actual dimension
1 1.000  ±0.076 Y 1.000  0.975  1.025  1.000 
2 0.800  ±0.076 Y 0.800  0.775  0.825  0.800 

Mass production capability

The manufacturing facilities are independent industrial plant. There're 16000 square meters
workshop area. And the brand new automatic equipment was introduced from Israel, Germany,
Japan and Taiwan area. As of now the manufacturing capability for 2-12 layer PCBs covers 300
thousand square feet per month. 7000-8000 types of different PCBs are shipped to worldwide
each month.
 
PRODUCTS & SERVICES
a) FR-4 TG>135, High TG>170, High CTI>600V
b) RO4350B, RO4003C, F4B microwave material
c) Aluminum based PCB, 1W/MK-3W/MK material
d) Layer Count up to 32 layers
e) Heavy Copper
f) Hybrid Material Multilayer PCB
g) Impedance Controlled PCB
h) HASL Lead free, Electroless Nickle Immersion Gold (ENIG), Immersion Silver, Immersion Tin,
OSP
i) Colour of Solder mask: Green, Blue, Yellow, Black, Red and it's relative Matt color
j) Special holes: blind via, countersink hole, castellation hole, press-fit hole
k) Quick turn-around (QTA) Delivery
l) Minimum Order Quantity (MOQ) 1 pcs
m) Door to Door shipment service
 
SERVICE AREA
North America, Oceania, Southeast Asia, Eastern Europe, Africa, Latin America, Western &
Southern Europe, Northern Europe, Central & South Asian, Middle East.


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