Rogers Tmm10I Wholesale Electronics PCB Circuit Board with Pure Gold Plated

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-154-V2.1
• Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Thickness: 75mil
• Layer Count: 2-Layer
• Application: Stripline and Microstrip
• Surface Finish: Pure Gold Plated
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers TMM10i Microwave Printed Circuit Board 75mil 1.905mm RF PCB With Pure Gold Plated
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description

This type of Microwave PCB is built on 75mil TMM10i substrate with 1oz copper(finished). It is a double layer board without solder mask and silkscreen. The surface finish on pads is pure gold plated with 80 micro inches, no nickle under gold. The boards are manufactured as per IPC Class II standard, every 25 boards are packed for shipment.


TMM10i laminates exhibit an exceptionally low thermal coefficient of dielectric constant, typically below 30 ppm/°C. Their isotropic thermal expansion coefficients closely match those of copper, ensuring high-reliability plated through holes and minimal etch shrinkage.

PCB Specifications

PCB SIZE	75 x 68mm=1up
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 17um(0.5 oz)+plate TOP layer
	TMM10i 1.905mm
	copper ------- 17um(0.5 oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	10 mil / 10 mil
Minimum / Maximum Holes:	0.45 mm / 3.50 mm
Number of Different Holes:	3
Number of Drill Holes:	3
Number of Milled Slots:	0
Number of Internal Cutouts:	no
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	TMM10i 1.905mm
Final foil external:	1.0 oz
Final foil internal:	N/A
Final height of PCB:	2.0 mm ±0.1
PLATING AND COATING
Surface Finish	Pure Gold-Plated (No nickle under gold), 52%
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.45mm.
FLAMIBILITY RATING	94V-0
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Additionally, TMM10i laminates offer approximately twice the thermal conductivity of conventional PTFE/ceramic laminates, significantly improving heat dissipation.

Typical Applications:
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems


Our PCB Capabilities (TMM10i)  

PCB Material:	Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:	TMM10i
Dielectric constant:	9.80 ±0.245
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),        150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm),         275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion tin, OSP, Pure Gold Plated (No Nickle under gold) etc..

Data Sheet of TMM10i   

TMM10i Typical Value
Property		TMM10i	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		9.80±0.245	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		9.9	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.002	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		-43	-	ppm/°K	-55ºC-125ºC	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		2 x 108	-	Mohm.cm	-	ASTM D257
Surface Resistivity		4 x 107	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		267	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	ºCTGA	-	ASTM D3850
Coefficient of Thermal Expansion - x		19	X	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		19	Y	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		20	Z	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.76	Z	W/m/K	80 ºC	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.0 (0.9)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		-	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.8	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.16	-	%	D/24/23	ASTM D570
	3.18mm (0.125")	0.13
Specific Gravity		2.77	-	-	A	ASTM D792
Specific Heat Capacity		0.72	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-