Precision RO3003 RF PCB - 0.88mm Thin Profile, , Enig Finish for Mmwave Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3003
• Model NO.: BIC-1103-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Precision RO3003 RF PCB - 0.88mm Thin Profile, 5/6 mil Trace, ENIG Finish for mmWave Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. High-Frequency Circuit Board Overview
This ultra-compact double-layer PCB utilizes Rogers RO3003 high-frequency laminate to deliver exceptional performance for next-generation wireless systems. Designed specifically for 77GHz automotive radar, 5G mmWave infrastructure, and satellite communications, this board combines ceramic-PTFE technology with industry-leading electrical stability in a space-efficient package.

Key Performance Advantages:
Ultra-Fine Circuitry: 5/6 mil trace/space capability enables high-density designs
Signal Integrity: 3.0±0.04 dielectric constant with 0.001 loss tangent at 10GHz
Thermal Reliability: 500°C decomposition temperature with matched CTE to copper
Moisture Resistance: 0.04% absorption maintains stable performance
Quality Assurance: 100% electrical testing with IPC-Class-2 compliance

2. Technical Specifications

Parameter	Precision Specification
Core Material	Rogers RO3003 ceramic-PTFE
Board Configuration	Dual-layer rigid construction
Dimensions	45mm × 54.3mm
Profile Thickness	0.88mm (30mil substrate)
Copper Weight	1oz (35μm) electrodeposited copper
Circuit Precision	5/6 mil trace/space
Microvia Technology	0.3mm minimum laser drill
Surface Treatment	Electroless Nickel Immersion Gold
Visual Marking	Green solder mask with white silkscreen
Via Plating	20μm thickness
Thermal Performance	0.5 W/mK conductivity

3. Advanced Capabilities & Applications
Cutting-Edge Material Properties

Frequency Stability: Maintains consistent Dk across temperature (-55°C to +288°C)

Thermal Management: 17/16/25 ppm/°C CTE minimizes mechanical stress

High-Frequency Optimization: Suitable for applications up to 77GHz

Manufacturing Efficiency: Compatible with hybrid multilayer constructions


Optimized Board Architecture
Component Integration: 27 components with 61 contact points (35 PTH, 26 SMT)

Interconnect Solution: 41 precision vias across 3 signal networks

RF-Optimized Surface: ENIG finish with single-sided green solder mask

Production Ready: Gerber RS-274-X file compatibility


Target Implementations
Automotive Radar: ADAS sensors, collision avoidance systems

5G Infrastructure: mmWave base stations, small cell antennas

Satellite Systems: GPS receivers, LNB modules

IoT Devices: High-frequency sensors, wireless datalinks


Competitive Advantages
Miniaturization Enabled: High-precision 5/6 mil circuitry in compact 45×54.3mm form factor

Signal Integrity Focus: Ultra-low loss tangent preserves high-frequency performance

Reliable Construction: 20μm via plating ensures durable interconnects

Cost-Effective Production: Standard FR-4 compatible processing


Engineered for Next-Gen Wireless Systems
Our engineering team provides comprehensive design support and rapid prototyping services. This solution delivers uncompromising performance for the most demanding high-frequency applications in automotive, telecom, and aerospace markets.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.