Rogers Rt/Duroid 6002 Printed Circuit Board PCB of Shenzhen PCB Design

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rt/Duroid 6002
• Model NO.: BIC-1150-V2.1
• Material: Ceramic-Filled PTFE
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Surface Finish: Immersion Gold
• Board Thickness: 1.1mm (Finished)
• Layer Count: 2-Layer
• Solder Mask: None
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 53.19mm x 69.23mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers RT/duroid 6002 PCB 2-Layer 1.1mm PTFE Microwave Material with Immersion Gold for High-Frequency Systems

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 

1. Overview of RT/duroid 6002 PCBs

This 2-layer rigid PCB employs Rogers RT/duroid 6002-a ceramic-filled PTFE microwave PCB material-engineered for complex high-frequency structures. With a low dielectric constant (Dk) of 2.94 ±0.04 and ultra-low dissipation factor (0.0012 at 10GHz), Rogers RT/duroid 6002 PCB delivers exceptional signal integrity in microwave applications. The material's thermal stability (TCDk: 12 ppm/°C) and low Z-axis CTE (24 ppm/°C) ensure reliability under temperature fluctuations. IPC-Class-2 certified and 100% electrically tested, it excels in aerospace and radar systems.

 

 

2. PCB Construction Details 

Parameter	Specification
Base Material	RT/duroid 6002
Layer Count	2 layers
Board Dimensions	53.19mm x 69.23mm
Minimum Trace/Space	5/7 mils
Minimum Hole Size	0.4mm
Blind Vias	None
Finished Thickness	1.1mm
Copper Weight (Outer)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top/Bottom Silkscreen	No
Top/Bottom Solder Mask	No
Electrical Test	100% pre-shipment

3. Additional Components & Features

PCB Statistics: 25 components, 64 pads (41 thru-hole, 23 top SMT), 42 vias, 2 nets.

Stackup Architecture:
Layer 1: 35μm copper
Core: 1.016mm RT/duroid 6002 (40mil ceramic-PTFE substrate)
Layer 2: 35μm copper

Production Standards:
Artwork: Gerber RS-274-X
Compliance: IPC-Class-2
Availability: Worldwide
 

Material Advantages:
Low out-gassing (space-applications qualified)
Copper-matched CTE for thermal resilience
Moisture absorption 0.02%
Thermal conductivity 0.6 W/m/K
 

 

Typical Applications: Phased array antennas, radar systems, GPS antennas, power backplanes, collision avoidance systems, beam forming networks.
 

Why Choose This PCB?

The ceramic-PTFE core ensures 30% lower signal loss versus standard HF materials, while immersion gold surface finish enhances corrosion resistance. With TGA thermal decomposition at 500°C and IPC-Class-2 validation, Rogers RT/duroid 6002 PCB withstands extreme environments in airborne and space systems.

Tags: RT/duroid 6002 PCB, 2-layer 1.1mm PCB, ceramic-filled PTFE, immersion gold PCB, phased array antenna board, space-grade circuit.
 

Order Now for Radar and Space Applications!

Deploy this high-reliability RT/duroid 6002 PCB in your next aerospace project-optimized for thermal stability and global availability. Request instant quotes for custom high-frequency solutions!