| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | Taconic Trf-45 (Woven-Glass Reinforced Ceramic-Ptf |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
The 2-layer TRF-45 PCB represents Taconic's next-generation RF solution, combining woven-glass reinforcement with advanced ceramic technology. This 0.9mm thick board features 1oz copper layers with 6/8 mil trace/space capability and 0.35mm minimum hole sizes, optimized for stable RF performance. The compact 65.53mm × 45.33mm (±0.15mm) design delivers exceptional dimensional stability across temperature ranges.
Key features include:
Lead-free HASL surface finish for RoHS compliance
No silkscreen or solder mask for streamlined production
100% electrical testing ensuring reliability
Low Z-axis CTE (40 ppm/°C) for thermal stability
Worldwide availability with IPC-Class-2 compliance
| Parameter | Specification |
|---|---|
| Base Material | Taconic TRF-45 |
| Layer Count | Double-sided (2-layer) |
| Board Dimensions | 65.53mm × 45.33mm (±0.15mm) |
| Minimum Trace/Space | 6/8 mils |
| Minimum Hole Size | 0.35mm |
| Finished Thickness | 0.9mm |
| Copper Weight | 1oz (35µm) outer layers |
| Via Plating Thickness | 20µm |
| Surface Finish | Lead-free HASL |
| Silkscreen | None |
| Solder Mask | None |
| Electrical Test | 100% tested prior to shipment |
Copper Layer 1: 35µm
TRF-45 Core: 0.813mm (32mil)
Copper Layer 2: 35µm
Optimized RF Performance: Dk 4.5 with 0.0035 dissipation factor at 10GHz
Thermal Reliability: Exceptionally low CTE (9/9/40 ppm/°C in x/y/z axes)
Frequency Stability: Consistent Dk across temperature and frequency ranges
Structural Integrity: Woven-glass reinforcement for dimensional stability
Process Advantages: Compatible with standard PCB fabrication methods
Satellite Systems: Radio and communication equipment
RFID Solutions: High-performance tag and reader systems
Aerospace Electronics: Avionics and radar components
Wireless Infrastructure: Base station antennas
Next-Gen Performance: Advanced ceramic/glass composite material
Thermal Consistency: Stable across soldering temperatures
Design Flexibility: Supports high-frequency layouts
Quality Assurance: 100% tested to IPC-Class-2 standards
Global Availability: Ready for immediate worldwide deployment
Power your RF designs with our TRF-45 2-layer PCB - engineered for stable performance in demanding environments.
Ideal for:
• Satellite communication systems
• RFID infrastructure
• Aerospace electronics
• Wireless base stations
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